Inventor · disambiguated record
Shinsuke Nakajyo
Also filed as: NAKAJYO SHINSUKE
3 granted patents·1 pending application·55 citations·filing 2000–2004
72Inventor score
Technology areasH10W
Files withFUJITSU LTD4
Top patents by PatentIndex Score
4 records- 0176US6420213B1Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesiveFUJITSU LTD·Filed 2000·Granted Jul 16, 2002·27 cites·11 claims
- 0274US6600217B2Mounting substrate and mounting method for semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jul 29, 2003·22 cites·10 claims
- 0355US6777250B1Manufacture of wafer level semiconductor device with quality markings on the sealing resinFUJITSU LTD·Filed 2000·Granted Aug 17, 2004·6 cites·5 claims
- 0439US2004235271A1Manufacture of wafer level semiconductor device with quality markings on the sealing resinFUJITSU LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →