Manufacture of wafer level semiconductor device with quality markings on the sealing resin

Abstract

A method of manufacturing semiconductor device in the method of manufacturing wafer level semiconductor device that can search the defective products from the marking information even when sealing resin is formed on the wafer and a semiconductor device manufactured with the same method. A method of manufacturing wafer level semiconductor comprises a process to seal with a resin material the surface of wafer having the front surface and rear surface and forming a plurality of semiconductor chips on the front surface, a first marking process for marking the position information corresponding to each chip to the region of each chip at the rear surface of the wafer, a process for performing the electrical test to each chip, a second marking process for marking the result of the electrical test to the region of each chip at the rear surface of the wafer and a dicing process for dicing the wafer to each chip.

What is claimed is:  
     
         1 . A semiconductor device comprising: 
 a semiconductor chip diced from the predetermined position of wafer wherein circuits are formed on the front surface,    a resin sealing the front surface of said semiconductor chip;    an external output terminal exposed from said resin and connected with said circuits; and    a marking provided at the rear surface of said semiconductor chip to indicate the predetermined position of said wafer.    
     
     
         2 . A semiconductor device comprising: 
 a semiconductor chip diced from the predetermined position of a wafer where circuits are formed on the front surface;    a resin sealing the front surface of said semiconductor chip;    an external output terminal exposed from said resin and connected with said circuit;    a resin sheet attached to the rear surface of said semiconductor chip; and    a marking indicating the predetermined position of said wafer printed on said resin sheet.