Inventor · disambiguated record
Toshio Shintani
Also filed as: SHINTANI TOSHIO
5 granted patents·27 pending applications·121 citations·filing 2001–2012
79Inventor score
Top patents by PatentIndex Score
32 records- 0193US6841737B2Wired circuit boardNITTO DENKO CORP·Filed 2002·Granted Jan 11, 2005·86 cites·7 claims
- 0280US6717059B2Circuit board and connection structure of terminal portion of the sameNITTO DENKO CORP·Filed 2001·Granted Apr 6, 2004·28 cites·10 claims
- 0372US7943235B2Adhesive sheet for processing semiconductor substratesNITTO DENKO CORP·Filed 2008·Granted May 17, 2011·4 cites·5 claims
- 0469US7727811B2Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrateNITTO DENKO CORP·Filed 2007·Granted Jun 1, 2010·3 cites·9 claims
- 0559US2008057216A1Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0655US2011151252A1Adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0751US2007036930A1Pressure-sensitive adhesive sheet, production method thereof and method of processing articlesNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 0848US2008057306A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0945US2010028662A1Adhesive sheet for processing semiconductor substratesNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1045US2009314417A1Method of grinding back side of semiconductor wafer and adhesive sheet for use in the method of grinding back side of semiconductor waferNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1144US2008118764A1Adhesive sheet for processing semiconductor wafers and/or substratesNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1244US2011097576A1Re-peelable adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1344US2008248296A1Pressure-sensitive adhesive sheet for processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1443US2007190318A1Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of workNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1543US2008085397A1Adhesive sheet for laser processingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1643US2008138618A1Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1742US2011300709A1Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheetSHINTANI TOSHIO·Filed 2011·Application pending·0 cites
- 1842US2012107573A1Pressure-sensitive adhesive tape for batteryIWATA JUN·Filed 2011·Application pending·0 cites
- 1942US2008038551A1Warpage-inhibitive pressure-sensitive adhesive sheets for wafer grindingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2041US2008057253A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2141US2008057270A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2241US2012196171A1Laminate for nonaqueous batteryIKISHIMA SHINSUKE·Filed 2012·Application pending·0 cites
- 2341US2008182095A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2441US2008108262A1Adhesive sheet for water jet laser dicingNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2539US2006257651A1Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with itSHINTANI TOSHIO·Filed 2006·Application pending·0 cites
- 2637US2012222805A1Tackiness adhesive sheet for thin-film substrate fixingSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
- 2737US2009311474A1Adhesive sheet for water jet laser dicingTAKAHASHI TOMOKAZU·Filed 2008·Application pending·0 cites
- 2836US2012223455A1Method for manufacturing thin-film substrateSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
- 2931US8388786B2Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheetHABU TAKASHI·Filed 2010·Granted Mar 5, 2013·0 cites·1 claims
- 3030US2014154450A1Adhesive tape or sheetYUTOU TAKUMI·Filed 2012·Application pending·0 cites
- 3129US2012114938A1Adhesive sheet for processing of semiconductor wafterOOISHI MICHIHITO·Filed 2011·Application pending·0 cites
- 3228US2013251985A1LaminateNAKANISHI TADATOSHI·Filed 2011·Application pending·0 cites
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