Assignee
SHINTANI TOSHIO
0 granted patents·4 pending applications·0 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0142US2011300709A1Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheetSHINTANI TOSHIO·Filed 2011·Application pending·0 cites
- 0239US2006257651A1Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with itSHINTANI TOSHIO·Filed 2006·Application pending·0 cites
- 0337US2012222805A1Tackiness adhesive sheet for thin-film substrate fixingSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
- 0436US2012223455A1Method for manufacturing thin-film substrateSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
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