Inventor · disambiguated record
Junji Ninomiya
Also filed as: NINOMIYA JUNJI
4 granted patents·6 pending applications·140 citations·filing 1997–2017
75Inventor score
Top patents by PatentIndex Score
10 records- 0188US5981085AComposite substrate for heat-generating semiconductor device and semiconductor apparatus using the sameFURUKAWA ELECTRIC CO LTD·Filed 1997·Granted Nov 9, 1999·129 cites·7 claims
- 0285US7857874B2Micro-reactor and method of manufacturing the sameDAINIPPON PRINTING CO LTD·Filed 2005·Granted Dec 28, 2010·8 cites·13 claims
- 0366US10408550B2Heat exchanger, and fin material for said heat exchangerUACJ CORP·Filed 2014·Granted Sep 10, 2019·1 cites·10 claims
- 0450US2008050269A1Aluminum piping material for automobile heat exchangerFURUKAWA SKY ALUMINUM CORP·Filed 2007·Application pending·0 cites
- 0549US2011041986A1Micro-reactor and method of manufacturing the sameDAINIPPON PRINTING CO LTD·Filed 2010·Application pending·0 cites
- 0644US2018133845A1Method of manufacturing an aluminum structureUACJ CORP·Filed 2016·Application pending·0 cites
- 0742US7485374B2Heat exchanger and fin material for the heat exchangerFURUKAWA SKY ALUMINUM CORP·Filed 2006·Granted Feb 3, 2009·2 cites·5 claims
- 0842US2018214964A1Method of manufacturing an aluminum structureUACJ CORP·Filed 2016·Application pending·0 cites
- 0938US2019162492A1Aluminum alloy fin material, aluminum alloy brazing sheet, and heat exchangerUACJ CORP·Filed 2017·Application pending·0 cites
- 1032US2019178591A1Hydrophilic film, and heat exchanger fin and heat exchanger using the hydrophilic filmUACJ CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →