Inventor · disambiguated record
Peter Scherl
Also filed as: SCHERL PETER
17 granted patents·4 pending applications·20 citations·filing 2009–2025
88Inventor score
Top patents by PatentIndex Score
21 records- 0195US11037856B2Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 15, 2021·4 cites·20 claims
- 0285US9633303B2Smart card module arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 25, 2017·7 cites·23 claims
- 0382US10566309B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 18, 2020·3 cites·25 claims
- 0473US8640961B2Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlayGRUENAUER MATTHIAS·Filed 2011·Granted Feb 4, 2014·5 cites·18 claims
- 0569US11631628B2Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 0668US11652084B2Flat lead package formation methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·6 claims
- 0766US2025233092A1Electronic device having a solder stop featureINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0864US12300643B2Solder stop feature for electronic devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·8 claims
- 0962US11302668B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
- 1060US9355984B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 31, 2016·1 cites·5 claims
- 1157US8272574B2Document for personal identification having protection against external manipulations and a method for producingGRUENAUER MATTHIAS·Filed 2009·Granted Sep 25, 2012·0 cites·22 claims
- 1256US12224222B2Semiconductor package having a thermally and electrically conductive spacerINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 11, 2025·0 cites·25 claims
- 1354US12183667B2Semiconductor package with power electronics carrier having trench spacing adapted for delaminationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1454US2024413118A1Solder barrier structure for power modulesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1551US8684273B2Cover structure with integrated chip and antennaINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 1, 2014·0 cites·8 claims
- 1650US2019103342A1Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1748US9756726B2Electronic device and method of fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 5, 2017·0 cites·15 claims
- 1848US9224695B2Chip arrangement and a method for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 29, 2015·0 cites·23 claims
- 1944US9141902B2Smart card module for a smart cardINFINEON TECHNOLOGIES AG·Filed 2012·Granted Sep 22, 2015·0 cites·11 claims
- 2043US9780053B2Method of forming a bondpad and bondpadINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·0 cites·15 claims
- 2142US2014091450A1Semiconductor Housing for Smart CardsINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →