Inventor · disambiguated record
Brian R. Sundlof
Also filed as: SUNDLOF BRIAN R · SUNDLOF BRIAN RICHARD
41 granted patents·5 pending applications·291 citations·filing 2003–2020
97Inventor score
Top patents by PatentIndex Score
46 records- 0197US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0294US9472520B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2012·Granted Oct 18, 2016·14 cites·19 claims
- 0393US11244917B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Feb 8, 2022·4 cites·11 claims
- 0493US7351360B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2004·Granted Apr 1, 2008·33 cites·15 claims
- 0591US10403590B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2017·Granted Sep 3, 2019·4 cites·9 claims
- 0691US7250675B2Method and apparatus for forming stacked die and substrate structures for increased packing densityIBM·Filed 2005·Granted Jul 31, 2007·19 cites·9 claims
- 0790US7611923B2Method and apparatus for forming stacked die and substrate structures for increased packing densityIBM·Filed 2007·Granted Nov 3, 2009·17 cites·9 claims
- 0889US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 0988US10396051B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2017·Granted Aug 27, 2019·3 cites·13 claims
- 1088US8604623B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2012·Granted Dec 10, 2013·4 cites·15 claims
- 1187US8293587B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2007·Granted Oct 23, 2012·9 cites·19 claims
- 1282US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 1382US8338286B2Dimensionally decoupled ball limiting metalurgyPERFECTO ERIC DAVID·Filed 2010·Granted Dec 25, 2012·10 cites·15 claims
- 1478US10622299B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2019·Granted Apr 14, 2020·1 cites·20 claims
- 1575US8268282B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2007·Granted Sep 18, 2012·4 cites·12 claims
- 1672US7288474B2Suspension for filling via holes in silicon and method for making the sameIBM·Filed 2006·Granted Oct 30, 2007·4 cites·10 claims
- 1771US9018760B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureIBM·Filed 2013·Granted Apr 28, 2015·2 cites·13 claims
- 1869US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 1969US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 2068US11094657B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Aug 17, 2021·0 cites·14 claims
- 2166US11171102B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
- 2264US8197612B2Optimization of metallurgical properties of a solder jointBUSBY JAMES A·Filed 2008·Granted Jun 12, 2012·2 cites·15 claims
- 2363US7449067B2Method and apparatus for filling viasIBM·Filed 2003·Granted Nov 11, 2008·12 cites·19 claims
- 2462US9640501B2Multilayer pillar for reduced stress interconnect and method of making sameIBM·Filed 2014·Granted May 2, 2017·0 cites·19 claims
- 2562US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 2661US10224274B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·16 claims
- 2760US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
- 2860US10224273B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·10 claims
- 2960US7784669B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 3059US7703661B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2007·Granted Apr 27, 2010·1 cites·22 claims
- 3158US9899313B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 3257US9263363B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2013·Granted Feb 16, 2016·0 cites·16 claims
- 3356US9111816B2Multilayer pillar for reduced stress interconnect and method of making sameJADHAV VIRENDRA R·Filed 2012·Granted Aug 18, 2015·0 cites·18 claims
- 3455US7708909B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2008·Granted May 4, 2010·2 cites·14 claims
- 3555US2009140423A1Underbump metallurgy employing sputter-deposited nickel titanium alloyIBM·Filed 2007·Application pending·0 cites
- 3653US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 3749US7897878B2Compliant penetrating packaging interconnectIBM·Filed 2007·Granted Mar 1, 2011·0 cites·17 claims
- 3849US2009134016A1Underbump metallurgy employing sputter-deposited nickel titanium copper alloyIBM·Filed 2007·Application pending·0 cites
- 3947US6823585B2Method of selective plating on a substrateIBM·Filed 2003·Granted Nov 30, 2004·2 cites·13 claims
- 4046US7683493B2Intermetallic diffusion block device and method of manufactureIBM·Filed 2008·Granted Mar 23, 2010·0 cites·7 claims
- 4146US7579069B2Negative coefficient of thermal expansion particles and method of forming the sameIBM·Filed 2003·Granted Aug 25, 2009·1 cites·4 claims
- 4246US7202154B2Suspension for filling via holes in silicon and method for making the sameIBM·Filed 2004·Granted Apr 10, 2007·1 cites·20 claims
- 4346US2006027934A1Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2005·Application pending·0 cites
- 4444US6916670B2Electronic package repair processIBM·Filed 2003·Granted Jul 12, 2005·1 cites·25 claims
- 4544US2010207056A1Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive adhesiveIBM·Filed 2010·Application pending·0 cites
- 4642US2012202343A1Method of forming underbump metallurgy structure employing sputter-deposited nickel copper alloyBELANGER LUC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →