US2010207056A1PendingUtilityA1

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive adhesive

Assignee: IBMPriority: Nov 12, 2004Filed: May 3, 2010Published: Aug 19, 2010

Est. expiryNov 12, 2024(expired)· nominal 20-yr term from priority

Inventors:Gareth G. Hougham Paul A. Lauro Brian R. Sundlof Jeffrey D. Gelorme

Y10S977/788Y10T428/24994B82Y 30/00Y10T156/10H10W 90/724H10W 40/258H10W 40/60H10W 40/25H10W 40/257

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Claims

Abstract

The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

Claims

exact text as granted — not AI-modified

1 . A thermally conductive paste composition comprising:
 platelets of a thermally-conductive material, wherein said platelets have an aspect ratio of at least 2:1; and   a liquid.   
     
     
         2 . The thermally conductive paste composition, according to  claim 1 , wherein said thermally-conductive material comprises a metal. 
     
     
         3 . The paste composition of  claim 1 , wherein said liquid is selected from the group consisting of liquid metals and oils. 
     
     
         4 . The paste composition of  claim 3 , wherein said oil is a polyalphaolefin oil.

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