Inventor · disambiguated record
Muneharu Morioka
Also filed as: MORIOKA MUNEHARU
17 granted patents·5 pending applications·644 citations·filing 1997–2012
96Inventor score
Files withFUJITSU LTD13SHINKO ELECTRIC IND CO3RENESAS ELECTRONICS CORP2FUJITSU MICROELECTRONICS LTD1MORIOKA MUNEHARU1
Top patents by PatentIndex Score
22 records- 0197US6351031B1Semiconductor device and method for manufacturing substrate of the sameFUJITSU LTD·Filed 2000·Granted Feb 26, 2002·185 cites·2 claims
- 0292US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0389US6875638B2Manufacturing method of a semiconductor device incorporating a passive element and a redistribution boardFUJITSU LTD·Filed 2002·Granted Apr 5, 2005·44 cites·16 claims
- 0489US6455920B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Sep 24, 2002·72 cites·3 claims
- 0585US7556985B2Method of fabricating semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 7, 2009·9 cites·1 claims
- 0683US6396155B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 2000·Granted May 28, 2002·39 cites·11 claims
- 0781US6693029B2Method of forming an insulative substrate having conductive filled viasFUJITSU LTD·Filed 2001·Granted Feb 17, 2004·24 cites·4 claims
- 0880US6657282B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2002·Granted Dec 2, 2003·19 cites·15 claims
- 0979US6573600B2Multilayer wiring substrate having differential signal wires and a general signal wire in different planesFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·29 cites·6 claims
- 1078US7064047B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·16 cites·9 claims
- 1177US6784542B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·15 cites·10 claims
- 1277US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 1374US6339261B1Semiconductor device and process of producing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jan 15, 2002·22 cites·3 claims
- 1473US6987054B2Method of fabricating a semiconductor device having a groove formed in a resin layerFUJITSU LTD·Filed 2002·Granted Jan 17, 2006·12 cites·10 claims
- 1567US8552542B2Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor deviceMORIOKA MUNEHARU·Filed 2012·Granted Oct 8, 2013·3 cites·23 claims
- 1656US6700198B2Resin for semiconductor wireSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 2, 2004·8 cites·1 claims
- 1748US2010055844A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1839US6348416B1Carrier substrate for producing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1999·Granted Feb 19, 2002·9 cites·9 claims
- 1939US2011266661A1Lead frame and method for manufacturing semiconductor device using the sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2038US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 2137US2010290202A1Semiconductor package, lead frame, and wiring board with the sameRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2230US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →