Inventor · disambiguated record
Kuan-Jui Huang
Also filed as: HUANG KUAN-JUI
5 granted patents·9 pending applications·27 citations·filing 2005–2011
75Inventor score
Top patents by PatentIndex Score
14 records- 0178US7732233B2Method for making light emitting diode chip packageTOUCH MICRO SYSTEM TECH·Filed 2009·Granted Jun 8, 2010·12 cites·13 claims
- 0277US7262078B2Method of forming a wear-resistant dielectric layerTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Aug 28, 2007·11 cites·8 claims
- 0359US8129206B2Light emitting diode package and method of making the sameLIN HUNG-YI·Filed 2009·Granted Mar 6, 2012·2 cites·10 claims
- 0458US7795131B2Method of fabricating metal interconnects and inter-metal dielectric layer thereofTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Sep 14, 2010·2 cites·16 claims
- 0549US7987588B2Interposer for connecting plurality of chips and method for manufacturing the sameTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Aug 2, 2011·0 cites·5 claims
- 0641US2012080693A1Light emitting diode package and method of making the sameLIN HUNG-YI·Filed 2011·Application pending·0 cites
- 0741US2009273004A1Chip package structure and method of making the sameLIN HUNG-YI·Filed 2009·Application pending·0 cites
- 0841US2008182432A1Interposer for connecting plurality of chips and method for manufacturing the sameHUANG KUAN-JUI·Filed 2007·Application pending·0 cites
- 0939US2006263934A1Chip-type micro-connector and method of packaging the sameHU SHU-HUA·Filed 2006·Application pending·0 cites
- 1037US2006186523A1Chip-type micro-connector and method of packaging the sameHU SHU-HUA·Filed 2005·Application pending·0 cites
- 1135US2012242623A1Touch sensitive device and display device employing the sameHO HSIEN-LUNG·Filed 2011·Application pending·0 cites
- 1234US2012230055A1Front light illumination device and reflective display device employing the sameHO HSIEN-LUNG·Filed 2011·Application pending·0 cites
- 1332US2008188024A1Method of fabricating micro mechanical moving member and metal interconnects thereofHUANG KUAN-JUI·Filed 2007·Application pending·0 cites
- 1432US2006183312A1Method of forming chip-type low-k dielectric layerHU SHU-HUA·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →