Assignee
TOUCH MICRO SYSTEM TECH
TW·40 granted patents·1 pending application·161 citations·filing 2004–2013
Top patents by PatentIndex Score
41 records- 0186US7514287B2Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Apr 7, 2009·17 cites·14 claims
- 0280US7741772B2White LED package structure having a silicon substrate and method of making the sameTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Jun 22, 2010·8 cites·7 claims
- 0380US7392687B2Method of calibrating zero offset of a pressure sensorTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Jul 1, 2008·13 cites·10 claims
- 0478US7732233B2Method for making light emitting diode chip packageTOUCH MICRO SYSTEM TECH·Filed 2009·Granted Jun 8, 2010·12 cites·13 claims
- 0578US7533564B2Micro sample heating apparatus and method of making the sameTOUCH MICRO SYSTEM TECH·Filed 2006·Granted May 19, 2009·10 cites·15 claims
- 0678US7306955B2Method of performing a double-sided processTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Dec 11, 2007·5 cites·13 claims
- 0777US7262078B2Method of forming a wear-resistant dielectric layerTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Aug 28, 2007·11 cites·8 claims
- 0875US7297610B2Method of segmenting a waferTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Nov 20, 2007·5 cites·17 claims
- 0975US7258806B1Method of fabricating a diaphragm of a capacitive microphone deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Aug 21, 2007·8 cites·9 claims
- 1071US7528000B2Method of fabricating optical device capsTOUCH MICRO SYSTEM TECH·Filed 2007·Granted May 5, 2009·5 cites·6 claims
- 1171US7395706B2Micro sample heating apparatus and method of making the sameTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Jul 8, 2008·4 cites·16 claims
- 1271US7235185B2Method of protecting wafer front pattern and method of performing double-sided processTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Jun 26, 2007·4 cites·7 claims
- 1370US8453318B2Method for making a planar coilTOUCH MICRO SYSTEM TECH·Filed 2012·Granted Jun 4, 2013·2 cites·13 claims
- 1470US7008821B1Method of forming a wafer backside interconnecting wireTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 7, 2006·21 cites·20 claims
- 1569US7598125B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Oct 6, 2009·5 cites·13 claims
- 1668US7585417B2Method of fabricating a diaphragm of a capacitive microphone deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Sep 8, 2009·5 cites·9 claims
- 1767US7505118B2Wafer carrierTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 17, 2009·8 cites·20 claims
- 1865US7192842B2Method for bonding wafersTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Mar 20, 2007·3 cites·12 claims
- 1964US7510892B2Light emitting diode structure and manufacturing method thereofTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Mar 31, 2009·2 cites·12 claims
- 2063US7393784B2Method of manufacturing suspension structure and chamberTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Jul 1, 2008·2 cites·9 claims
- 2162US7393774B2Method of fabricating microconnectorsTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Jul 1, 2008·1 cites·11 claims
- 2260US7821094B2Light emitting diode structureTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Oct 26, 2010·1 cites·5 claims
- 2360US7510947B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Mar 31, 2009·2 cites·25 claims
- 2460US7432208B2Method of manufacturing suspension structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Oct 7, 2008·1 cites·9 claims
- 2558US7795131B2Method of fabricating metal interconnects and inter-metal dielectric layer thereofTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Sep 14, 2010·2 cites·16 claims
- 2657US7361284B2Method for wafer-level packageTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Apr 22, 2008·1 cites·15 claims
- 2756US7413963B2Method of edge bevel rinseTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Aug 19, 2008·2 cites·11 claims
- 2854US7566574B2Method of performing a double-sided processTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Jul 28, 2009·0 cites·13 claims
- 2952US7456043B2Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereofTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Nov 25, 2008·1 cites·9 claims
- 3049US7987588B2Interposer for connecting plurality of chips and method for manufacturing the sameTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Aug 2, 2011·0 cites·5 claims
- 3148US7938977B2Method of modulating resonant frequency of torsional MEMS deviceTOUCH MICRO SYSTEM TECH·Filed 2010·Granted May 10, 2011·0 cites·10 claims
- 3244US7674392B2Method of fabricating a hingeTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Mar 9, 2010·0 cites·14 claims
- 3344US7465601B2Method of forming suspended structureTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Dec 16, 2008·0 cites·15 claims
- 3443US7531457B2Method of fabricating suspended structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted May 12, 2009·0 cites·12 claims
- 3542US7582511B2Method for wafer level chip scale packaging with passive components integrated into packaging structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Sep 1, 2009·0 cites·22 claims
- 3640US7622334B2Wafer-level packaging cutting method capable of protecting contact padsTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Nov 24, 2009·0 cites·15 claims
- 3740US7256128B2Method of double-sided etchingTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Aug 14, 2007·0 cites·10 claims
- 3840US7045463B2Method of etching cavities having different aspect ratiosTOUCH MICRO SYSTEM TECH·Filed 2004·Granted May 16, 2006·0 cites·11 claims
- 3939US2013258293A1Phase Modulation Module and Projector Comprising the SameTOUCH MICRO SYSTEM TECH·Filed 2013·Application pending·0 cites
- 4031US7410821B2Method of fabricating suspended structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Aug 12, 2008·0 cites·9 claims
- 4125US7470565B2Method of wafer level packaging and cuttingTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Dec 30, 2008·0 cites·27 claims
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