Inventor · disambiguated record
Mark A. Jaso
Also filed as: JASO MARK · JASO MARK A · JASO MARK ANTHONY
26 granted patents·2 pending applications·1,267 citations·filing 1991–2008
97Inventor score
Top patents by PatentIndex Score
28 records- 0192US6093631ADummy patterns for aluminum chemical polishing (CMP)IBM·Filed 1998·Granted Jul 25, 2000·112 cites·6 claims
- 0292US5246884ACvd diamond or diamond-like carbon for chemical-mechanical polish etch stopIBM·Filed 1991·Granted Sep 21, 1993·174 cites·25 claims
- 0390US6045434AMethod and apparatus of monitoring polishing pad wear during processingIBM·Filed 1997·Granted Apr 4, 2000·88 cites·6 claims
- 0490US6025226AMethod of forming a capacitor and a capacitor formed using the methodIBM·Filed 1998·Granted Feb 15, 2000·107 cites·28 claims
- 0590US5894152ASOI/bulk hybrid substrate and method of forming the sameIBM·Filed 1997·Granted Apr 13, 1999·99 cites·19 claims
- 0689US6344409B1Dummy patterns for aluminum chemical polishing (CMP)IBM·Filed 2000·Granted Feb 5, 2002·42 cites·12 claims
- 0788US6811657B2Device for measuring the profile of a metal film sputter deposition target, and system and method employing sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 2, 2004·22 cites·43 claims
- 0888US5055158APlanarization of Josephson integrated circuitIBM·Filed 1991·Granted Oct 8, 1991·78 cites·14 claims
- 0985US6186864B1Method and apparatus for monitoring polishing pad wear during processingIBM·Filed 1999·Granted Feb 13, 2001·58 cites·21 claims
- 1084US6107125ASOI/bulk hybrid substrate and method of forming the sameIBM·Filed 1998·Granted Aug 22, 2000·64 cites·8 claims
- 1183US6166423AIntegrated circuit having a via and a capacitorIBM·Filed 1999·Granted Dec 26, 2000·59 cites·7 claims
- 1282US6632377B1Chemical-mechanical planarization of metallurgyIBM·Filed 1999·Granted Oct 14, 2003·70 cites·10 claims
- 1381US5573633AMethod of chemically mechanically polishing an electronic componentIBM·Filed 1995·Granted Nov 12, 1996·56 cites·11 claims
- 1478US5656535AStorage node process for deep trench-based DRAMSIEMENS AG·Filed 1996·Granted Aug 12, 1997·42 cites·20 claims
- 1577US5854140AMethod of making an aluminum contactSIEMENS AG·Filed 1996·Granted Dec 29, 1998·54 cites·11 claims
- 1672US6974524B1Apparatus, method and system for monitoring chamber parameters associated with a deposition processMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 13, 2005·7 cites·50 claims
- 1770US7974505B2Method for fabricating selectively coupled optical waveguides on a substrateBAE SYS INF & ELECT SYS INTEG·Filed 2008·Granted Jul 5, 2011·5 cites·6 claims
- 1870US6153474AMethod of controllably forming a LOCOS oxide layer over a portion of a vertically extending sidewall of a trench extending into a semiconductor substrateIBM·Filed 1998·Granted Nov 28, 2000·28 cites·18 claims
- 1963US5726099AMethod of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurryIBM·Filed 1995·Granted Mar 10, 1998·28 cites·6 claims
- 2061US2006054497A1Apparatus, method and system for monitoring chamber parameters associated with a deposition processJASO MARK A·Filed 2005·Application pending·0 cites
- 2159US5264387AMethod of forming uniformly thin, isolated silicon mesas on an insulating substrateIBM·Filed 1992·Granted Nov 23, 1993·27 cites·12 claims
- 2257US8192638B2Method for manufacturing multiple layers of waveguidesPOMERENE ANDREW T S·Filed 2008·Granted Jun 5, 2012·2 cites·6 claims
- 2355US6136686AFabrication of interconnects with two different thicknessesIBM·Filed 1997·Granted Oct 24, 2000·21 cites·17 claims
- 2451US2005023132A1Device for measuring the profile of a metal film sputter deposition target, and system and method employing sameFiled 2004·Application pending·0 cites
- 2542US5795826AMethod of chemically mechanically polishing an electronic componentIBM·Filed 1996·Granted Aug 18, 1998·9 cites·9 claims
- 2641US6114248AProcess to reduce localized polish stop erosionIBM·Filed 1998·Granted Sep 5, 2000·8 cites·9 claims
- 2733US5885899AMethod of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurryIBM·Filed 1995·Granted Mar 23, 1999·5 cites·14 claims
- 2831US6177348B1Low temperature via fill using liquid phase transportIBM·Filed 1998·Granted Jan 23, 2001·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →