Inventor · disambiguated record
Alfons Vindasius
Also filed as: VINDASIUS ALFONS
9 granted patents·649 citations·filing 1997–2007
92Inventor score
Files withCUBIC MEMORY INC6CUBIC MEMORY1VERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC1VERTICAL CIRCUITS INC1
Top patents by PatentIndex Score
9 records- 0197US5891761AMethod for forming vertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY INC·Filed 1997·Granted Apr 6, 1999·151 cites·22 claims
- 0294US7535109B2Die assembly having electrical interconnectVERTICAL CIRCUITS INC·Filed 2007·Granted May 19, 2009·38 cites·54 claims
- 0392US6098278AMethod for forming conductive epoxy flip-chip on chipCUBIC MEMORY INC·Filed 1997·Granted Aug 8, 2000·91 cites·14 claims
- 0488US6255726B1Vertical interconnect process for silicon segments with dielectric isolationCUBIC MEMORY INC·Filed 1997·Granted Jul 3, 2001·72 cites·23 claims
- 0587US6271598B1Conductive epoxy flip-chip on chipCUBIC MEMORY INC·Filed 1997·Granted Aug 7, 2001·114 cites·2 claims
- 0686US6177296B1Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY INC·Filed 1999·Granted Jan 23, 2001·55 cites·23 claims
- 0783US8357999B2Assembly having stacked die mounted on substrateVERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC·Filed 2007·Granted Jan 22, 2013·14 cites·92 claims
- 0883US6080596AMethod for forming vertical interconnect process for silicon segments with dielectric isolationCUBIC MEMORY INC·Filed 1997·Granted Jun 27, 2000·75 cites·19 claims
- 0972US6124633AVertical interconnect process for silicon segments with thermally conductive epoxy preformCUBIC MEMORY·Filed 1997·Granted Sep 26, 2000·39 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →