Inventor · disambiguated record
Lim Thiam Chye
Also filed as: CHYE LIM T · CHYE LIM THIAM
27 granted patents·1,714 citations·filing 2000–2013
98Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0198US7573136B2Semiconductor device assemblies and packages including multiple semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·128 cites·9 claims
- 0298US7198980B2Methods for assembling multiple semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 3, 2007·230 cites·22 claims
- 0398US6906415B2Semiconductor device assemblies and packages including multiple semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·203 cites·55 claims
- 0497US6951982B2Packaged microelectronic component assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 4, 2005·159 cites·37 claims
- 0597US6876066B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 5, 2005·137 cites·31 claims
- 0696US7109572B2Quad flat no lead (QFN) grid array packageMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 19, 2006·78 cites·15 claims
- 0796US6967125B2Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 22, 2005·94 cites·24 claims
- 0896US6746894B2Ball grid array interposer, packages and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·249 cites·56 claims
- 0995US6943450B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 13, 2005·93 cites·15 claims
- 1093US7075816B2Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 11, 2006·55 cites·20 claims
- 1193US6650013B2Method of manufacturing wire bonded microelectronic device assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 18, 2003·107 cites·45 claims
- 1288US7279780B2Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 9, 2007·12 cites·16 claims
- 1387US6864166B1Method of manufacturing wire bonded microelectronic device assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 8, 2005·51 cites·31 claims
- 1481US7977157B2Methods of forming integrated circuit packages, and methods of assembling integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2010·Granted Jul 12, 2011·4 cites·4 claims
- 1581US6773960B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 10, 2004·21 cites·26 claims
- 1678US6825572B2Die packageMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·21 cites·53 claims
- 1773US7528007B2Methods for assembling semiconductor devices and interposersMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·5 cites·22 claims
- 1871US7112876B2Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriersMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·3 cites·18 claims
- 1971US6870247B2Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembledMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 22, 2005·12 cites·18 claims
- 2070US7700406B2Methods of assembling integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 20, 2010·3 cites·7 claims
- 2168US7274095B2Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposersMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 25, 2007·12 cites·32 claims
- 2267US8709866B2Methods of forming integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·1 cites·9 claims
- 2364US7368810B2Invertible microfeature device packagesMICRON TECHNOLOGY INC·Filed 2003·Granted May 6, 2008·10 cites·25 claims
- 2463US6951777B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 4, 2005·7 cites·27 claims
- 2562US6617201B2U-shape tape for BOC FBGA package to improve moldabilityMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 9, 2003·11 cites·9 claims
- 2654US6486536B1U-shape tape for BOC FBGA package to improve moldabilityMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·8 cites·13 claims
- 2747US8531031B2Integrated circuit packagesFEE SETHO SING·Filed 2011·Granted Sep 10, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →