Assignee
FEE SETHO SING
SG·2 granted patents·0 citations·filing 2010–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0147US8531031B2Integrated circuit packagesFEE SETHO SING·Filed 2011·Granted Sep 10, 2013·0 cites·9 claims
- 0246US8319332B2Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contactsFEE SETHO SING·Filed 2010·Granted Nov 27, 2012·0 cites·26 claims
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