Inventor · disambiguated record
Roman Mostovoy
Also filed as: MOSTOVOY ROMAN · MOSTOVOY ROMAN M
5 granted patents·10 pending applications·81 citations·filing 2000–2024
78Inventor score
Top patents by PatentIndex Score
15 records- 0193US6416634B1Method and apparatus for reducing target arcing during sputter depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jul 9, 2002·56 cites·24 claims
- 0278US6428663B1Preventing defect generation from targets through applying metal spray coatings on sidewallsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 6, 2002·19 cites·15 claims
- 0375US2024321555A1System and method of cleaning process chamber componentsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0471US10695804B2Equipment cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·1 cites·19 claims
- 0570US12014902B2System and method of cleaning process chamber componentsAPPLIED MATERIALS INC·Filed 2022·Granted Jun 18, 2024·0 cites·19 claims
- 0655US2025284274A1Real time in-situ metrology and process performance improvementAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0755US2025316504A1Cleaning device for semiconductor and flat panel display processing toolsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0854US6379428B1Method for reducing particle concentration within a semiconductor device fabrication toolAPPLIED MATERIALS INC·Filed 2000·Granted Apr 30, 2002·5 cites·20 claims
- 0948US2005218000A1Conditioning of contact leads for metal plating systemsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1046US2004222101A1Contact ring spin during idle time and deplate for defect reductionAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 1137US2004118697A1Metal deposition process with pre-cleaning before electrochemical depositionAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1236US2003150734A1Electroplating solution composition controlAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1335US2004200725A1Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating processAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1435US2012060924A1Methods and systems for forming functionally graded films by spray pyrolysisMATUS YURIY B·Filed 2011·Application pending·0 cites
- 1535US2012064699A1Methods and systems for spray pyrolysis with addition of volatile non-polar materialsMATUS YURIY B·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →