Inventor · disambiguated record
Chiew Hai Ng
Also filed as: NG CHIEW HAI
2 granted patents·1 pending application·0 citations·filing 2013–2015
25Inventor score
Files withAVAGO TECHNOLOGIES GENERAL IP3
Top patents by PatentIndex Score
3 records- 0144US2015098482A1Methods for dicing a compound semiconductor wafer, and diced wafers and die obtained therebyAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Application pending·0 cites
- 0242US9034734B2Systems and methods for plasma etching compound semiconductor (CS) dies and passively aligning the diesAVAGO TECHNOLOGIES GENERAL IP·Filed 2013·Granted May 19, 2015·0 cites·20 claims
- 0335US9851516B2Optical components assemblyAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Dec 26, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →