Inventor · disambiguated record
Chengyu Niu
Also filed as: NIU CHENGYU · NIU CHENGYU C · NIU CHENGYU CHARLES
14 granted patents·2 pending applications·103 citations·filing 2007–2017
91Inventor score
Top patents by PatentIndex Score
16 records- 0197US9721889B1Middle of the line (MOL) metal contactsGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 1, 2017·21 cites·20 claims
- 0292US8729702B1Copper seed layer for an interconnect structure having a doping concentration level gradientST MICROELECTRONICS INC·Filed 2012·Granted May 20, 2014·13 cites·26 claims
- 0390US8242876B2Dual thin film precision resistance trimmingLE NEEL OLIVIER·Filed 2009·Granted Aug 14, 2012·25 cites·19 claims
- 0488US8493171B2Dual thin film precision resistance trimmingLE NEEL OLIVIER·Filed 2012·Granted Jul 23, 2013·11 cites·18 claims
- 0586US8400257B2Via-less thin film resistor with a dielectric capLIM TING FANG·Filed 2010·Granted Mar 19, 2013·16 cites·22 claims
- 0685US10283608B2Low resistance contacts to source or drain region of transistorGLOBALFOUNDRIES INC·Filed 2017·Granted May 7, 2019·4 cites·11 claims
- 0782US9111938B2Copper interconnect with CVD liner and metallic capIBM·Filed 2014·Granted Aug 18, 2015·5 cites·8 claims
- 0882US9059176B2Copper interconnect with CVD liner and metallic capBAUMANN FRIEDER HAINRICH·Filed 2012·Granted Jun 16, 2015·8 cites·18 claims
- 0955US10553497B2Methods and devices for enhancing mobility of charge carriersST MICROELECTRONICS INC·Filed 2016·Granted Feb 4, 2020·0 cites·20 claims
- 1055US10438856B2Methods and devices for enhancing mobility of charge carriersST MICROELECTRONICS INC·Filed 2013·Granted Oct 8, 2019·0 cites·56 claims
- 1154US10026693B2Method, apparatus, and system for MOL interconnects without titanium linerGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 17, 2018·0 cites·8 claims
- 1253US10546789B2Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriersST MICROELECTRONICS INC·Filed 2015·Granted Jan 28, 2020·0 cites·19 claims
- 1352US9679807B1Method, apparatus, and system for MOL interconnects without titanium linerGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 13, 2017·0 cites·15 claims
- 1450US9859217B1Middle of the line (MOL) metal contactsGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 2, 2018·0 cites·18 claims
- 1542US2007232060A1Hybrid ionized physical vapor deposition of via and trench linersST MICROELECTRONICS INC·Filed 2007·Application pending·0 cites
- 1640US2014138837A1Sandwiched diffusion barrier and metal liner for an interconnect structureST MICROELECTRONICS INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →