Inventor · disambiguated record
Rei Kiumi
Also filed as: KIUMI REI
4 granted patents·4 pending applications·51 citations·filing 2003–2010
76Inventor score
Top patents by PatentIndex Score
8 records- 0187US8252167B2Plating apparatusKURIYAMA FUMIO·Filed 2010·Granted Aug 28, 2012·4 cites·14 claims
- 0287US7012333B2Lead free bump and method of forming the sameEBARA CORP·Filed 2003·Granted Mar 14, 2006·36 cites·5 claims
- 0374US7875158B2Plating apparatusEBARA CORP·Filed 2004·Granted Jan 25, 2011·7 cites·14 claims
- 0473US8317993B2Plating method and apparatusKURIYAMA FUMIO·Filed 2009·Granted Nov 27, 2012·4 cites·11 claims
- 0567US2009218231A1Plating apparatusYAJIMA TOSHIKAZU·Filed 2009·Application pending·0 cites
- 0648US2004262150A1Plating deviceFiled 2003·Application pending·0 cites
- 0746US2005279640A1Method of forming a lead-free bump and a plating apparatus thereforSHIMOYAMA MASASHI·Filed 2005·Application pending·0 cites
- 0841US2007117365A1Plating method and apparatusEBARA CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →