Inventor · disambiguated record
Philip Hsin-Hua Li
Also filed as: LI PHILIP · LI PHILIP H · LI PHILIP HSIN-HUA
8 granted patents·4 pending applications·41 citations·filing 2005–2024
82Inventor score
Top patents by PatentIndex Score
12 records- 0196US9356061B2Image sensor with buried light shield and vertical gateAPPLE INC·Filed 2013·Granted May 31, 2016·19 cites·20 claims
- 0293US9842875B2Image sensor with buried light shield and vertical gateAPPLE INC·Filed 2016·Granted Dec 12, 2017·9 cites·20 claims
- 0379US12211947B2Copper, indium, gallium, selenium (CIGS) films with improved quantum efficiencyAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
- 0479US2025098363A1Copper, indium, gallium, selenium (cigs) films with improved quantum efficiencyAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0577US7341915B2Method of making planar double gate silicon-on-insulator structuresFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Mar 11, 2008·9 cites·18 claims
- 0667US7253455B2pHEMT with barrier optimized for low temperature operationFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 7, 2007·4 cites·13 claims
- 0764US11728449B2Copper, indium, gallium, selenium (CIGS) films with improved quantum efficiencyAPPLIED MATERIALS INC·Filed 2019·Granted Aug 15, 2023·0 cites·18 claims
- 0864US11088293B2Methods and apparatus for producing copper-indium-gallium-selenium (CIGS) filmAPPLIED MATERIALS INC·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 0962US11018275B2Method of creating CIGS photodiode for image sensor applicationsAPPLIED MATERIALS INC·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 1048US2021111222A1PROCESS TO IMPROVE INTERFACE STATE DENSITY Dit ON DEEP TRENCH ISOLATION (DTI) FOR CMOS IMAGE SENSORAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1145US2021151949A1Bonding vertical cavity surface emitting laser die onto a silicon waferAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1244US2020006412A1Methods and apparatus for image sensor semiconductorsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →