Inventor · disambiguated record
Mi-Ja Han
Also filed as: HAN MI-JA
33 granted patents·5 pending applications·162 citations·filing 2007–2020
96Inventor score
Top patents by PatentIndex Score
38 records- 0198US10842021B1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 17, 2020·11 cites·20 claims
- 0296US9853003B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 26, 2017·31 cites·20 claims
- 0390US10083929B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 25, 2018·7 cites·17 claims
- 0488US7764149B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 27, 2010·18 cites·11 claims
- 0585US10157886B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·4 cites·15 claims
- 0683US8598468B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 0782US7944320B2Electromagnetic bandgap structure and printed circuit board including multi-viaSAMSUNG ELECTRO MECH·Filed 2008·Granted May 17, 2011·14 cites·16 claims
- 0881US8279616B2Printed circuit board with embedded chip capacitorKIM HAN·Filed 2011·Granted Oct 2, 2012·4 cites·9 claims
- 0981US8102219B2Electromagnetic bandgap structure and printed circuit boardKOO JA-BU·Filed 2009·Granted Jan 24, 2012·12 cites·6 claims
- 1079US10600679B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 24, 2020·3 cites·21 claims
- 1179US8699234B2EMI noise shield board including electromagnetic bandgap structureKIM HAN·Filed 2011·Granted Apr 15, 2014·6 cites·8 claims
- 1278US9496594B2Printed circuit board and printed circuit board for camera moduleSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 15, 2016·3 cites·31 claims
- 1378US8164006B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted Apr 24, 2012·6 cites·12 claims
- 1477US10304807B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 1576US8035991B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 11, 2011·5 cites·14 claims
- 1674US7563104B2Printed circuit board having connectorsSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 21, 2009·5 cites·4 claims
- 1773US10217631B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 26, 2019·2 cites·22 claims
- 1871US8258408B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Sep 4, 2012·5 cites·7 claims
- 1971US8212150B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 3, 2012·5 cites·8 claims
- 2071US8153907B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2008·Granted Apr 10, 2012·6 cites·6 claims
- 2170US10770403B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·16 claims
- 2268US8422248B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2011·Granted Apr 16, 2013·1 cites·6 claims
- 2367US8253025B2Printed circuit board having electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Aug 28, 2012·3 cites·3 claims
- 2465US10373884B2Fan-out semiconductor package for packaging semiconductor chip and capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 6, 2019·1 cites·24 claims
- 2560US8314341B2Printed circuit board having electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Nov 20, 2012·1 cites·6 claims
- 2654US2009085691A1Printed circuit board with embedded chip capacitor and chip capacitor embedment methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2752US8853560B2Electromagnetic bandgap structure and printed circuit boardPARK DAE-HYUN·Filed 2012·Granted Oct 7, 2014·0 cites·9 claims
- 2852US2011069470A1Electromagnetic interference noise reduction board using electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2951US8242377B2Printed circuit board having electromagnetic bandgap structureJUNG HYO-JIC·Filed 2009·Granted Aug 14, 2012·1 cites·4 claims
- 3051US7965521B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 21, 2011·0 cites·10 claims
- 3151US2010132996A1Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3250US10475751B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 12, 2019·0 cites·13 claims
- 3349US10923433B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·24 claims
- 3447US2009071603A1Method of manufacturing printed circuit board and electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3546US8077000B2Electromagnetic bandgap structure and printed circuit boardKOO JA-BU·Filed 2008·Granted Dec 13, 2011·0 cites·15 claims
- 3641US11069666B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 20, 2021·0 cites·17 claims
- 3739US8420949B2Electromagnetic bandgap structure and printed circuit boardHAN MI-JA·Filed 2008·Granted Apr 16, 2013·0 cites·13 claims
- 3833US2015348918A1Package substrate, package, package on package and manufacturing method of package substrateSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →