Inventor · disambiguated record
Yasushi Inagaki
Also filed as: INAGAKI YASUSHI
48 granted patents·13 pending applications·896 citations·filing 1996–2018
98Inventor score
Files withIBIDEN CO LTD44INAGAKI YASUSHI14ALPS ALPINE CO LTD1ALPS ELECTRIC CO LTD1MURATA MANUFACTURING CO1
Top patents by PatentIndex Score
61 records- 0199US7307852B2Printed circuit board and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Dec 11, 2007·82 cites·21 claims
- 0299US6876554B1Printing wiring board and method of producing the same and capacitor to be contained in printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 5, 2005·160 cites·4 claims
- 0399US6724638B1Printed wiring board and method of producing the sameIBIDEN CO LTD·Filed 2000·Granted Apr 20, 2004·249 cites·10 claims
- 0498US7978478B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jul 12, 2011·46 cites·8 claims
- 0597US7342803B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Mar 11, 2008·92 cites·20 claims
- 0696US7855894B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Dec 21, 2010·26 cites·12 claims
- 0795US8830691B2Printed circuit board and method of manufacturing printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Sep 9, 2014·12 cites·28 claims
- 0895US7995352B2Printed circuit boardIBIDEN CO LTD·Filed 2010·Granted Aug 9, 2011·11 cites·18 claims
- 0995US7864542B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Jan 4, 2011·21 cites·14 claims
- 1093US8110750B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2009·Granted Feb 7, 2012·17 cites·5 claims
- 1192US8331102B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Dec 11, 2012·14 cites·19 claims
- 1292US8116091B2Printed circuit boardINAGAKI YASUSHI·Filed 2010·Granted Feb 14, 2012·7 cites·22 claims
- 1392US7881069B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 1, 2011·13 cites·14 claims
- 1491US8569880B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2010·Granted Oct 29, 2013·10 cites·18 claims
- 1591US8119920B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2005·Granted Feb 21, 2012·16 cites·6 claims
- 1690US8780573B2Printed circuit boardINAGAKI YASUSHI·Filed 2012·Granted Jul 15, 2014·6 cites·20 claims
- 1789US7864543B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jan 4, 2011·9 cites·8 claims
- 1888US9443800B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Sep 13, 2016·7 cites·20 claims
- 1988US9287250B2Package substrateIBIDEN CO LTD·Filed 2015·Granted Mar 15, 2016·7 cites·20 claims
- 2088US8107253B2Printed circuit boardINAGAKI YASUSHI·Filed 2008·Granted Jan 31, 2012·9 cites·16 claims
- 2186US7507913B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2003·Granted Mar 24, 2009·24 cites·16 claims
- 2283US7800216B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Sep 21, 2010·9 cites·7 claims
- 2381US8763241B2Method of manufacturing printed wiring boardINAGAKI YASUSHI·Filed 2011·Granted Jul 1, 2014·2 cites·20 claims
- 2480US9763319B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Sep 12, 2017·4 cites·20 claims
- 2580US8021748B2Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing sameIBIDEN CO LTD·Filed 2004·Granted Sep 20, 2011·17 cites·10 claims
- 2678US9263784B2Package substrateIBIDEN CO LTD·Filed 2015·Granted Feb 16, 2016·3 cites·20 claims
- 2775US9716059B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Jul 25, 2017·4 cites·20 claims
- 2875US8842440B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2013·Granted Sep 23, 2014·1 cites·22 claims
- 2974US9699909B2Wiring board with built-in electronic componentIBIDEN CO LTD·Filed 2014·Granted Jul 4, 2017·5 cites·20 claims
- 3074US8717772B2Printed circuit boardINAGAKI YASUSHI·Filed 2009·Granted May 6, 2014·2 cites·20 claims
- 3171US9060446B2Printed circuit boardIBIDEN CO LTD·Filed 2014·Granted Jun 16, 2015·1 cites·20 claims
- 3270US10409026B2Lens driving device, camera module, and method for manufacturing lens driving deviceALPS ALPINE CO LTD·Filed 2018·Granted Sep 10, 2019·1 cites·12 claims
- 3370US8729400B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2008·Granted May 20, 2014·2 cites·19 claims
- 3469US10134693B2Printed wiring boardIBIDEN CO LTD·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 3568US8592688B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2009·Granted Nov 26, 2013·2 cites·2 claims
- 3663US9564392B2Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2016·Granted Feb 7, 2017·1 cites·20 claims
- 3760US9101054B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2013·Granted Aug 4, 2015·0 cites·20 claims
- 3860US2013248234A1Multilayer Printed Wiring BoardIBIDEN CO LTD·Filed 2013·Application pending·0 cites
- 3957US8754334B2Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2012·Granted Jun 17, 2014·0 cites·20 claims
- 4057US2008296052A1Multilayer printed wiring boardIBIDEN CO LTD·Filed 2008·Application pending·0 cites
- 4156US9226397B2Multilayer printed wiring board having multilayer core substrateIBIDEN CO LTD·Filed 2013·Granted Dec 29, 2015·0 cites·12 claims
- 4256US2015250056A1Printed circuit boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 4356US2011303451A1Multilayer printed wiring boardINAGAKI YASUSHI·Filed 2011·Application pending·0 cites
- 4455US2008014336A1Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the sameIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 4555US2008023815A1Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the sameIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 4645US2015040389A1Method for manufacturing wiring board with built-in electronic componentIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 4744US2014374150A1Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 4840US9854669B2Package substrateIBIDEN CO LTD·Filed 2015·Granted Dec 26, 2017·0 cites·20 claims
- 4940US9538651B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 5040US9510447B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Nov 29, 2016·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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