Inventor · disambiguated record
Tadashi Mitsui
Also filed as: MITSUI TADASHI
44 granted patents·2 pending applications·1,034 citations·filing 1979–2011
98Inventor score
Top patents by PatentIndex Score
46 records- 0197US5049029AHandling apparatus for transferring a semiconductor wafer or LCDTOKYO ELECTRON LTD·Filed 1990·Granted Sep 17, 1991·427 cites·10 claims
- 0293US4424504AFerrite coreTDK ELECTRONICS CO LTD·Filed 1982·Granted Jan 3, 1984·65 cites·7 claims
- 0392US4760366AFerrite coreTDK CORP·Filed 1987·Granted Jul 26, 1988·52 cites·5 claims
- 0491US4549158AInductance elementTDK CORP·Filed 1984·Granted Oct 22, 1985·43 cites·6 claims
- 0590US8532395B2Pattern inspection method and semiconductor device manufacturing methodMITSUI TADASHI·Filed 2011·Granted Sep 10, 2013·9 cites·15 claims
- 0688US4939494ASurface-mounted-type inductance elementTDK CORP·Filed 1989·Granted Jul 3, 1990·45 cites·29 claims
- 0786US4352080AFerrite coreTDK ELECTRONICS CO LTD·Filed 1980·Granted Sep 28, 1982·37 cites·2 claims
- 0884USD280810SFerrite coreTDK CORP·Filed 1982·Granted Oct 1, 1985·19 cites·1 claims
- 0983US7526408B2Measurement system and method and computer program for processing measurement dataTOSHIBA KK·Filed 2005·Granted Apr 28, 2009·7 cites·24 claims
- 1081US5702567APlurality of photolithographic alignment marks with shape, size and spacing based on circuit pattern featuresTOSHIBA KK·Filed 1995·Granted Dec 30, 1997·56 cites·13 claims
- 1180US7668373B2Pattern evaluation method, method of manufacturing semiconductor, program and pattern evaluation apparatusTOSHIBA KK·Filed 2005·Granted Feb 23, 2010·15 cites·12 claims
- 1277US5491339ACharged particle detection device and charged particle radiation apparatusTOSHIBA KK·Filed 1994·Granted Feb 13, 1996·29 cites·22 claims
- 1375US6278114B1Method and apparatus for measuring dimensions of a feature of a specimenTOSHIBA KK·Filed 1998·Granted Aug 21, 2001·26 cites·20 claims
- 1474US5611942AMethod for producing tips for atomic force microscopesTOSHIBA KK·Filed 1995·Granted Mar 18, 1997·47 cites·23 claims
- 1573US8150177B2Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and programMITSUI TADASHI·Filed 2011·Granted Apr 3, 2012·2 cites·6 claims
- 1673USD264959STransformer core memberTDK ELECTRONICS CO LTD·Filed 1979·Granted Jun 15, 1982·12 cites·1 claims
- 1770US5691540AAssembly for measuring a trench depth parameter of a workpieceIBM·Filed 1996·Granted Nov 25, 1997·32 cites·6 claims
- 1869US7702157B2Pattern evaluation method, pattern matching method and computer readable mediumTOSHIBA KK·Filed 2006·Granted Apr 20, 2010·6 cites·11 claims
- 1969US5917205APhotolithographic alignment marks based on circuit pattern featureTOSHIBA KK·Filed 1997·Granted Jun 29, 1999·39 cites·11 claims
- 2066US8090192B2Pattern misalignment measurement method, program, and semiconductor device manufacturing methodMITSUI TADASHI·Filed 2007·Granted Jan 3, 2012·2 cites·18 claims
- 2166USD334913SBobbin for use with a magnetic coreTDK CORP·Filed 1990·Granted Apr 20, 1993·12 cites·1 claims
- 2264US8144338B2Pattern measurement apparatus and pattern measurement methodMITSUI TADASHI·Filed 2009·Granted Mar 27, 2012·4 cites·8 claims
- 2364US8041105B2Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing methodTOSHIBA KK·Filed 2007·Granted Oct 18, 2011·3 cites·20 claims
- 2462US8086041B2Pattern evaluation method, pattern matching method and computer readable mediumMITSUI TADASHI·Filed 2010·Granted Dec 27, 2011·2 cites·6 claims
- 2561US7787687B2Pattern shape evaluation apparatus, pattern shape evaluation method, method of manufacturing semiconductor device, and programTOSHIBA KK·Filed 2006·Granted Aug 31, 2010·4 cites·11 claims
- 2658US6985626B2Pattern evaluation method, pattern evaluation system and computer-readable recorded mediumTOSHIBA KK·Filed 2002·Granted Jan 10, 2006·12 cites·46 claims
- 2756US7274820B2Pattern evaluation system, pattern evaluation method and programTOSHIBA KK·Filed 2002·Granted Sep 25, 2007·6 cites·17 claims
- 2856USD385848SBobbin and magnetic core assemblyTDK CORP·Filed 1995·Granted Nov 4, 1997·9 cites·1 claims
- 2955US8019165B2Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and programTOSHIBA KK·Filed 2007·Granted Sep 13, 2011·0 cites·14 claims
- 3054US7754114B2Methods for manufacturing optical fiber probe and for processing micromaterialNAT INST FOR MATERIALS SCIENCE·Filed 2008·Granted Jul 13, 2010·0 cites·5 claims
- 3151US7151855B2Pattern measurement method, manufacturing method of semiconductor device, pattern measurement apparatus, and programTOSHIBA KK·Filed 2003·Granted Dec 19, 2006·6 cites·30 claims
- 3250US8290242B2Defect inspection apparatus and defect inspection methodMITSUI TADASHI·Filed 2009·Granted Oct 16, 2012·0 cites·15 claims
- 3350US7341681B2Method of manufacturing optical fiber probe and for finishing micro materialNAT INST FOR MATERIALS SCIENCE·Filed 2003·Granted Mar 11, 2008·2 cites·8 claims
- 3450US6769963B2IC handler and contact cleaning methodANDO ELECTRIC·Filed 2001·Granted Aug 3, 2004·4 cites·8 claims
- 3547US8045807B2Pattern edge detecting method and pattern evaluating methodTOSHIBA KK·Filed 2009·Granted Oct 25, 2011·0 cites·12 claims
- 3647US8019149B2Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the sameTOSHIBA KK·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 3746US8144969B2Pattern evaluation method, computer-readable recording medium, and manufacturing method of semiconductor deviceMITSUI TADASHI·Filed 2009·Granted Mar 27, 2012·0 cites·20 claims
- 3846US7771697B2Method for preparing functional nanomaterials utilizing endothermic reactionJAPAN SCIENCE & TECH AGENCY·Filed 2002·Granted Aug 10, 2010·0 cites·3 claims
- 3945US9153419B2Pattern defect inspection using data based on secondary electron from patternMITSUI TADASHI·Filed 2011·Granted Oct 6, 2015·0 cites·22 claims
- 4044US8160349B2Pattern shape evaluation method, program, and semiconductor device manufacturing methodMITSUI TADASHI·Filed 2007·Granted Apr 17, 2012·0 cites·15 claims
- 4143US8355560B2Pattern evaluation system, pattern evaluation method and semiconductor device manufacturing methodTOSHIBA KK·Filed 2010·Granted Jan 15, 2013·0 cites·11 claims
- 4242US2006261268A1Pattern measuring system and semiconductor device manufacturing methodMITSUI TADASHI·Filed 2006·Application pending·0 cites
- 4341US2004247172A1Pattern measuring apparatus, pattern measuring method, and manufacturing method of semiconductor deviceFiled 2004·Application pending·0 cites
- 4440US8036445B2Pattern matching method, program and semiconductor device manufacturing methodTOSHIBA KK·Filed 2005·Granted Oct 11, 2011·0 cites·12 claims
- 4539US7879309B2Method for preparing functional nanomaterials utilizing endothermic reactionJAPAN SCIENCE & TECH AGENCY·Filed 2010·Granted Feb 1, 2011·0 cites·8 claims
- 4635US8126257B2Alignment of semiconductor wafer patterns by corresponding edge groupsMIYANO YUMIKO·Filed 2007·Granted Feb 28, 2012·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →