Inventor · disambiguated record
Hideya Murai
Also filed as: MURAI HIDEYA
40 granted patents·13 pending applications·904 citations·filing 1988–2014
98Inventor score
Top patents by PatentIndex Score
53 records- 0197US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0295US8569892B2Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2009·Granted Oct 29, 2013·41 cites·9 claims
- 0392US7294393B2Sheet material and wiring boardNEC CORP·Filed 2005·Granted Nov 13, 2007·22 cites·23 claims
- 0492US6256082B1Liquid crystal display with a liquid crystal orientation controlling electrode and processes for manufacturing and driving thereofNEC CORP·Filed 1998·Granted Jul 3, 2001·114 cites·16 claims
- 0591US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 0690US5959707ALiquid crystal display having domains with different tilted-up directions as well as domains with different twist directions of lc moleculesNEC CORP·Filed 1996·Granted Sep 28, 1999·101 cites·20 claims
- 0789US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0888US8710639B2Semiconductor element-embedded wiring substrateKIKUCHI KATSUMI·Filed 2011·Granted Apr 29, 2014·11 cites·21 claims
- 0988US6466293B1Liquid crystal display with a liquid crystal orientation controlling electrode and processes for manufacturing and driving thereofNEC CORP·Filed 2000·Granted Oct 15, 2002·31 cites·22 claims
- 1087US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 1185US8766440B2Wiring board with built-in semiconductor elementKIKUCHI KATSUMI·Filed 2011·Granted Jul 1, 2014·9 cites·29 claims
- 1285US8035217B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2008·Granted Oct 11, 2011·9 cites·20 claims
- 1384US8304915B2Semiconductor device and method for manufacturing the sameMORI KENTARO·Filed 2009·Granted Nov 6, 2012·12 cites·23 claims
- 1484US7348673B2Semiconductor deviceNEC CORP·Filed 2005·Granted Mar 25, 2008·13 cites·34 claims
- 1584US5796456ALiquid crystal display with optical negative uni-axial compensation layerNEC CORP·Filed 1996·Granted Aug 18, 1998·74 cites·13 claims
- 1680US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 1778US6987551B2In-plane switching liquid crystal display unit having tinting compensationNEC CORP·Filed 2003·Granted Jan 17, 2006·14 cites·17 claims
- 1877US6115093ALiquid crystal display device having at least two micro areas of liquid crystal layer capable of being built up from a center of each pixelNEC CORP·Filed 1998·Granted Sep 5, 2000·51 cites·22 claims
- 1976US6456352B1Liquid crystal display deviceNEC CORP·Filed 2000·Granted Sep 24, 2002·17 cites·8 claims
- 2075US7495734B2In-plane-switching liquid crystal display unitNEC CORP·Filed 2005·Granted Feb 24, 2009·3 cites·15 claims
- 2174US7999401B2Semiconductor device and method of manufacturing sameNEC CORP·Filed 2008·Granted Aug 16, 2011·6 cites·20 claims
- 2273US5963290ALiquid crystal displayNEC CORP·Filed 1997·Granted Oct 5, 1999·35 cites·12 claims
- 2372US8929090B2Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2011·Granted Jan 6, 2015·4 cites·19 claims
- 2472US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 2572US6583839B2In-plane-switching liquid crystal display unit having tinting compensationNEC CORP·Filed 1997·Granted Jun 24, 2003·32 cites·9 claims
- 2672US5674576ALiquid crystalline optical device operable at a low drive voltageNEC CORP·Filed 1995·Granted Oct 7, 1997·45 cites·17 claims
- 2770US8810008B2Semiconductor element-embedded substrate, and method of manufacturing the substrateMORI KENTARO·Filed 2011·Granted Aug 19, 2014·3 cites·29 claims
- 2867US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 2965US6081311ALiquid crystal display apparatus having high wide visual angle and high contrastNEC CORP·Filed 1997·Granted Jun 27, 2000·32 cites·12 claims
- 3064US6300996B1Liquid crystal display apparatusNEC COPORATION·Filed 1999·Granted Oct 9, 2001·32 cites·8 claims
- 3163US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 3261US5409744APolymer dispersed liquid crystal optical devicesNEC CORP·Filed 1993·Granted Apr 25, 1995·17 cites·17 claims
- 3359US4892912AProcess for producing aromatic polyesterIDEMITSU PETROCHEMICAL CO·Filed 1988·Granted Jan 9, 1990·11 cites·5 claims
- 3458US8043953B2Semiconductor device including an LSI chip and a method for manufacturing the sameNEC CORP·Filed 2008·Granted Oct 25, 2011·1 cites·7 claims
- 3557US6160604ALiquid crystal display with pixel electrode having aperture containing additional electrodeNEC CORP·Filed 1999·Granted Dec 12, 2000·18 cites·3 claims
- 3655US8344498B2Semiconductor deviceNEC CORP·Filed 2008·Granted Jan 1, 2013·0 cites·3 claims
- 3754US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 3852US2013087927A1Multimedia providing serviceNEC CORP·Filed 2012·Application pending·0 cites
- 3950US8975150B2Semiconductor device manufacturing methodMORI KENTARO·Filed 2011·Granted Mar 10, 2015·0 cites·13 claims
- 4050US6195144B1Multiple domain-divided twisted nematic liquid crystal display with compensation filmNEC CORP·Filed 1997·Granted Feb 27, 2001·16 cites·9 claims
- 4150US2014024177A1Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2013·Application pending·0 cites
- 4249US6177976B1Liquid crystal displayNEC CORP·Filed 1999·Granted Jan 23, 2001·12 cites·2 claims
- 4348US2015053474A1Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2014·Application pending·0 cites
- 4448US2010314778A1Semiconductor device and method for producing the sameNEC CORP·Filed 2009·Application pending·0 cites
- 4548US2014367863A1Semiconductor deviceYAMAMICHI SHINTARO·Filed 2014·Application pending·0 cites
- 4647US2009046441A1Wiring board for mounting semiconductor device, manufacturing method of the same, and wiring board assemblyNEC CORP·Filed 2006·Application pending·0 cites
- 4746US2010103634A1Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipmentFUNAYA TAKUO·Filed 2008·Application pending·0 cites
- 4845US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4940US2009001604A1Semiconductor Package and Method for Producing SameTANAKA DAISUKE·Filed 2006·Application pending·0 cites
- 5040US2004089470A1Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrateNEC CORP·Filed 2003·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →