Inventor · disambiguated record
Ikuo Yoshida
Also filed as: YOSHIDA IKUO
36 granted patents·13 pending applications·1,184 citations·filing 1988–2011
98Inventor score
Files withHITACHI LTD20MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8PANASONIC CORP5PANASONIC COMM CO LTD3MAENISHI YASUHIRO2
Top patents by PatentIndex Score
49 records- 0198US6208525B1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 1998·Granted Mar 27, 2001·270 cites·12 claims
- 0293US6433412B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Aug 13, 2002·92 cites·9 claims
- 0392US6780677B2Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2002·Granted Aug 24, 2004·43 cites·7 claims
- 0491US6492737B1Electronic device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Dec 10, 2002·73 cites·10 claims
- 0590US8019455B2Component mounting order deciding method and component mounting order deciding apparatusPANASONIC CORP·Filed 2005·Granted Sep 13, 2011·19 cites·13 claims
- 0690US6971161B1Method for generating component mounting data and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 6, 2005·61 cites·44 claims
- 0789US6842974B1Component mounting method and component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 18, 2005·39 cites·19 claims
- 0889US5188280AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1991·Granted Feb 23, 1993·114 cites·31 claims
- 0987US7365426B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Apr 29, 2008·12 cites·24 claims
- 1087US6996440B2Method for optimization of an order of component mounting, apparatus using the same, and mounterMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 7, 2006·35 cites·15 claims
- 1187US6461896B1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 8, 2002·27 cites·9 claims
- 1286US5090609AMethod of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metalsHITACHI LTD·Filed 1990·Granted Feb 25, 1992·98 cites·24 claims
- 1382US5229447AAlkali soluble pressure sensitive adhesive compositionsSAIDEN CHEMICAL IND CO LTD·Filed 1992·Granted Jul 20, 1993·45 cites·10 claims
- 1478US6528343B1Semiconductor device its manufacturing method and electronic deviceHITACHI LTD·Filed 2000·Granted Mar 4, 2003·24 cites·19 claims
- 1577US7395129B2Method for optimization of an order of component mounting, apparatus using the same, and mounterMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 1, 2008·21 cites·29 claims
- 1676US6737741B2Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2002·Granted May 18, 2004·13 cites·2 claims
- 1774US6714383B2Magnetic disk apparatusHITACHI LTD·Filed 2000·Granted Mar 30, 2004·10 cites·22 claims
- 1871US6727583B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Apr 27, 2004·13 cites·33 claims
- 1967US6635512B1Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chipsROHM CO LTD·Filed 2000·Granted Oct 21, 2003·9 cites·5 claims
- 2066US6489181B2Method of manufacturing a semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 3, 2002·12 cites·26 claims
- 2165US7057278B2Semiconductor deviceHITACHI LTD·Filed 2003·Granted Jun 6, 2006·9 cites·21 claims
- 2264US7664554B2Line balance control method, line balance control apparatus, and component mounting machinePANASONIC CORP·Filed 2005·Granted Feb 16, 2010·3 cites·25 claims
- 2363US7571539B2Component verification method and apparatusPANASONIC CORP·Filed 2004·Granted Aug 11, 2009·10 cites·11 claims
- 2462US6646350B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Nov 11, 2003·11 cites·12 claims
- 2561US8344558B2Production system power supply control method, and production systemPANASONIC CORP·Filed 2011·Granted Jan 1, 2013·1 cites·7 claims
- 2661US7603193B2Method for optimization of an order for component mounting and apparatus for optimization of an order for component mountingPANASONIC CORP·Filed 2004·Granted Oct 13, 2009·9 cites·15 claims
- 2761US7493491B2Server, a terminal apparatus and an image management methodPANASONIC COMM CO LTD·Filed 2003·Granted Feb 17, 2009·9 cites·2 claims
- 2861US6800945B2Multi-chip semiconductor device with specific chip arrangementHITACHI LTD·Filed 2002·Granted Oct 5, 2004·8 cites·18 claims
- 2961US4945048AProcess for producing L-sorbose by subculture of seedTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1988·Granted Jul 31, 1990·25 cites·4 claims
- 3057US5885852APackaged semiconductor device having a flange at its side surface and its manufacturing methodHITACHI LTD·Filed 1997·Granted Mar 23, 1999·25 cites·13 claims
- 3156US7226336B2Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chipsROHM CO LTD·Filed 2003·Granted Jun 5, 2007·4 cites·2 claims
- 3255US8058338B2Anticorrosive pigment composition and water-based anticorrosive coating material containing the sameKONDO HAJIME·Filed 2008·Granted Nov 15, 2011·0 cites·6 claims
- 3355US6787395B2Method of manufacturing a multi-chip moduleRENESAS TECH CORP·Filed 2002·Granted Sep 7, 2004·6 cites·8 claims
- 3454US7313859B2Method for optimizing placement order by placement apparatuses that place electronic components on circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 1, 2008·5 cites·6 claims
- 3552US7133731B2Component mounting sequence optimizing method, component mounting device, program for executing component mounting sequence optimizing method, and recording medium in which the program is recordedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 7, 2006·4 cites·9 claims
- 3650US2007021964A1Identification method of apparatus to be recalled and heating methodMAENISHI YASUHIRO·Filed 2004·Application pending·0 cites
- 3749US2006047353A1Method for optimization of an order of component mounting, apparatus using the same, and mounterMAENISHI YASUHIRO·Filed 2005·Application pending·0 cites
- 3848US2007168881A1Multifunction apparatus, server, and server systemPANASONIC COMM CO LTD·Filed 2007·Application pending·0 cites
- 3947US2007282974A1Distribution server, multifunction appratus and distribution server systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 4045US2008091735A1Document management systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 4144US2004070630A1Multifunction apparatus, server, and server systemPANASONIC COMM CO LTD·Filed 2003·Application pending·0 cites
- 4242US2005029673A1Multi-chip semiconductor device with specific chip arrangementHITACHI LTD·Filed 2004·Application pending·0 cites
- 4341US2001002163A1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2001·Application pending·0 cites
- 4441US2001002162A1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2001·Application pending·0 cites
- 4540US2006265865A1Apparatus for determining support member layout patternsYOSHIDA IKUO·Filed 2004·Application pending·0 cites
- 4640US2008030800A1Electronic document management systemMATSUKAWA SHIGERU·Filed 2007·Application pending·0 cites
- 4739US2006117560A1Component mounting order optimization method, component mounting order optimization program, recording medium for the program, and component mounting apparatus using the methodYAMASAKI AKIHITO·Filed 2003·Application pending·0 cites
- 4837US2003102570A1Electronic device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Application pending·0 cites
- 4933US5305206AApparatus for producing an operation manual for use with a host systemRICOH KK·Filed 1991·Granted Apr 19, 1994·25 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →