Inventor · disambiguated record
Jaesun An
Also filed as: AN JAESUN
2 granted patents·1 pending application·78 citations·filing 2009–2011
67Inventor score
Technology areasH05K
Top patents by PatentIndex Score
3 records- 0192US8093690B2Chip package and manufacturing method thereofKO DONGKYUN·Filed 2009·Granted Jan 10, 2012·63 cites·18 claims
- 0289US8592958B2Chip package and manufacturing method thereofKO DONGKYUN·Filed 2011·Granted Nov 26, 2013·15 cites·20 claims
- 0353US2010110656A1Chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →