Inventor · disambiguated record
Chia-Yu Peng
Also filed as: PENG CHIA-YU
9 granted patents·5 pending applications·4 citations·filing 2020–2024
75Inventor score
Top patents by PatentIndex Score
14 records- 0195US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0272US12266616B2Integrated circuit package structureUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Apr 1, 2025·0 cites·4 claims
- 0359US11824012B2Integrated circuit package structure and method of manufacturing the sameUNIMICRON TECH CORPORATION·Filed 2020·Granted Nov 21, 2023·0 cites·7 claims
- 0459US2025331101A1Collapse-free circuit structure with low capacitance effectUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0557US2024413067A1Electronic package module and method for fabrication of the sameUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0656US12160953B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 0752US2023335419A1Etching device and etching methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0851US12369250B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 0949US11710690B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1048US11764120B2Chip packaging structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·4 claims
- 1148US11682612B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 1248US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 1348US2022069489A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 1448US2022328387A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →