Inventor · disambiguated record
Chin-Hsien Lin
Also filed as: LIN CHIN-HSIEN
2 granted patents·3 pending applications·25 citations·filing 2001–2023
60Inventor score
Top patents by PatentIndex Score
5 records- 0182US7218006B2Multi-chip stack packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 15, 2007·19 cites·11 claims
- 0260US2023364160A1Method for treating parkinson’s disease by using parabacteroides goldsteiniiMULTISTARS BIOTECHNOLOGY COMPANY LTD·Filed 2023·Application pending·0 cites
- 0352US7037750B2Method for manufacturing a packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 2, 2006·6 cites·11 claims
- 0437US2006242967A1Termoelectric heating and cooling apparatus for semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 0535US2003096473A1Method for making metal capacitors with low leakage currents for mixed-signal devicesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →