Inventor · disambiguated record
Jong-Ung Lee
Also filed as: LEE JONG-UNG
2 granted patents·2 pending applications·16 citations·filing 2004–2010
51Inventor score
Top patents by PatentIndex Score
4 records- 0166US7235887B2Semiconductor package with improved chip attachment and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 26, 2007·16 cites·25 claims
- 0245US2007187827A1Semiconductor package, stack package using the same package and method of fabricating the sameLEE JONG-UNG·Filed 2006·Application pending·0 cites
- 0332US8829748B2Connecting molding for automation of three-phase motor windingJANG JIN WOOK·Filed 2010·Granted Sep 9, 2014·0 cites·2 claims
- 0429US2006003491A1Apparatus for ejecting relatively thin IC chip from semiconductor waferKIM GOON-WOO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →