Semiconductor package, stack package using the same package and method of fabricating the same

Abstract

A semiconductor package may include a substrate. A conductive bump may be provided on a bottom surface of the substrate. A semiconductor chip may be provided on a top surface of the substrate. A sealing material may seal the semiconductor chip on the top of the substrate. A first conductive adhesive may be provided on a top surface of the sealing material. A second conductive adhesive may be provided on a side surface of the substrate and a side surface of the sealing material.

1 . A semiconductor package comprising: 
 a substrate;    a conductive bump provided on a bottom surface of the substrate;    a semiconductor chip provided on a top surface of the substrate;    a sealing material provided on the semiconductor chip;    a first conductive adhesive provided on a top surface of the sealing material; and    a second conductive adhesive provided on a side surface of the substrate and a side surface of the sealing material.    
   
   
       2 . The semiconductor package of  claim 1 , wherein the first conductive adhesive is a printable adhesive.  
   
   
       3 . The semiconductor package of  claim 1 , wherein the second conductive adhesive is a jettable adhesive.  
   
   
       4 . The semiconductor package of  claim 1 , wherein the second conductive adhesive is fabricated by jetting the second conductive adhesive onto a side surface of the substrate and a side surface of the sealing material.  
   
   
       5 . The semiconductor package of  claim 4 , wherein the second conductive adhesive has a stacked-ball shape, each ball in the stack having a diameter of 50 μm.  
   
   
       6 . The semiconductor package of  claim 1 , wherein the first conductive adhesive includes a conductive bump land.  
   
   
       7 . A stack package comprising: 
 a first semiconductor package according to  claim 1;  and    a second semiconductor package stacked on the first semiconductor package.    
   
   
       8 . The stack package of  claim 7 , wherein the first conductive adhesive includes a conductive bump land attached to the second semiconductor package.  
   
   
       9 . The stack package of  claim 8 , wherein the second semiconductor package includes a second printed circuit board with a second conductive bump provided on a bottom of the second semiconductor package, and 
 wherein the second conductive bump is attached to the conductive bump land of the first conductive adhesive.    
   
   
       10 . The stack package of  claim 9 , wherein the second semiconductor package includes 
 a second sealing material sealing a semiconductor chip provided on a top surface of the second printed circuit board, and    a marking for package information is provided on a top surface of the second sealing material.    
   
   
       11 . The stack package of  claim 7 , further comprising at least one semiconductor package with the same structure as the first semiconductor package, the at least one semiconductor package provided between the first semiconductor package and the second semiconductor package.  
   
   
       12 . The package of  claim 1 , wherein the substrate is printed circuit board.  
   
   
       13 . The package of  claim 1 , wherein the second conductive adhesive electrically connects the conductive bump with the first conductive adhesive.  
   
   
       14 . A method of fabricating a stack package comprising: 
 providing a frame having a top surface supporting a semiconductor chip and a sealing material sealing the semiconductor chip;    providing a first conductive adhesive on a top surface of the sealing material;    providing a conductive bump on a bottom surface of the frame;    separating a first semiconductor package from the frame;    providing a second conductive adhesive on a side surface of the first semiconductor package to electrically connect the first conductive adhesive with the conductive bump.    
   
   
       15 . The method of  claim 14 , further comprising screen printing the first conductive adhesive onto the sealing material.  
   
   
       16 . The method of  claim 14 , further comprising jetting the second conductive adhesive onto a side surface of the first semiconductor package.  
   
   
       17 . The method of  claim 16 , wherein jetting the second conductive adhesive provides a stacked-ball shape, each ball in the stack having a diameter of 50 μm.  
   
   
       18 . The method of  claim 14 , further comprising: 
 attaching a second semiconductor package to a conductive bump land of the first conductive adhesive of the first semiconductor package.    
   
   
       19 . The method of  claim 18 , wherein the second semiconductor package includes a second printed circuit board with a second conductive bump provided on a bottom of the second semiconductor package, and 
 wherein attaching of the second semiconductor package includes 
 performing a flux dotting process on the conductive bump land, and  
 performing an infrared re-flow process to attach the second conductive bump to the conductive bump land.  
   
   
   
       20 . The method of  claim 18 , further comprising: 
 attaching the first semiconductor package to the top of at least one additional semiconductor package having the same structure as that of the first semiconductor package.