Inventor · disambiguated record
Nolan L. Zimmerman
Also filed as: ZIMMERMAN NOLAN · ZIMMERMAN NOLAN L · ZIMMERMAN NOLAN LAYNE
16 granted patents·9 pending applications·60 citations·filing 2002–2025
90Inventor score
Top patents by PatentIndex Score
25 records- 0187US8500968B2Deplating contacts in an electrochemical plating apparatusWOODRUFF DANIEL J·Filed 2010·Granted Aug 6, 2013·7 cites·15 claims
- 0285US7811422B2Electro-chemical processor with wafer retainerSEMITOOL INC·Filed 2007·Granted Oct 12, 2010·4 cites·15 claims
- 0384US11982008B2Electroplating systemAPPLIED MATERIALS INC·Filed 2023·Granted May 14, 2024·0 cites·5 claims
- 0483US11795566B2Paddle chamber with anti-splashing bafflesAPPLIED MATERIALS INC·Filed 2020·Granted Oct 24, 2023·1 cites·17 claims
- 0580US11578422B2Electroplating systemAPPLIED MATERIALS INC·Filed 2022·Granted Feb 14, 2023·0 cites·17 claims
- 0679US10087543B2Seal rings in electrochemical processorsAPPLIED MATERIALS INC·Filed 2017·Granted Oct 2, 2018·3 cites·11 claims
- 0778US7393439B2Integrated microfeature workpiece processing tools with registration systems for paddle reactorsSEMITOOL INC·Filed 2003·Granted Jul 1, 2008·11 cites·23 claims
- 0877US7390383B2Paddles and enclosures for enhancing mass transfer during processing of microfeature workpiecesSEMITOOL INC·Filed 2003·Granted Jun 24, 2008·17 cites·39 claims
- 0975US2025347020A1Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1073US11268208B2Electroplating systemAPPLIED MATERIALS INC·Filed 2020·Granted Mar 8, 2022·0 cites·15 claims
- 1173US7390382B2Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methodsSEMITOOL INC·Filed 2003·Granted Jun 24, 2008·13 cites·22 claims
- 1271US2024271312A1Paddle chamber with anti-splashing bafflesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1367US2025116028A1Electroplating chamber using jet array to enable high mass-transferAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1465US12344955B2Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 1565US7294243B2Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereofSEMITOOL INC·Filed 2002·Granted Nov 13, 2007·4 cites·6 claims
- 1659US2025118572A1Anneal chamberAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1758US11697887B2Multi-compartment electrochemical replenishment cellAPPLIED MATERIALS INC·Filed 2020·Granted Jul 11, 2023·0 cites·20 claims
- 1857US2024201580A1Photomask handling assembly for atmospheric pressure plasma chamberAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1955US12460299B2Wet clean spray process chamber for substratesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·19 claims
- 2053US2014262795A1Electroplating processor with vacuum rotorAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2150US2008011450A1Apparatus and Method for Thermally Controlled Processing of Microelectronic WorkpiecesSEMITOOL INC·Filed 2007·Application pending·0 cites
- 2246US11814744B2Substrate cleaning components and methods in a plating systemAPPLIED MATERIALS INC·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 2344US2013306465A1Seal rings in electrochemical processorsZIMMERMAN NOLAN L·Filed 2012·Application pending·0 cites
- 2443US2008029123A1Sonic and chemical wafer processorAEGERTER BRIAN·Filed 2006·Application pending·0 cites
- 2540US7252714B2Apparatus and method for thermally controlled processing of microelectronic workpiecesSEMITOOL INC·Filed 2002·Granted Aug 7, 2007·0 cites·64 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →