Inventor · disambiguated record
Shankar Venkataraman
Also filed as: VENKATARAMAN SHANKAR · VENKATARAMAN SHANKAR C
108 granted patents·34 pending applications·8,948 citations·filing 1999–2025
99Inventor score
Top patents by PatentIndex Score
142 records- 0199US9773695B2Integrated bit-line airgap formation and gate stack post cleanAPPLIED MATERIALS INC·Filed 2016·Granted Sep 26, 2017·113 cites·15 claims
- 0299US9144147B2Semiconductor processing system and methods using capacitively coupled plasmaAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·188 cites·11 claims
- 0399US6413583B1Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compoundAPPLIED MATERIALS INC·Filed 1999·Granted Jul 2, 2002·725 cites·6 claims
- 0498US10354843B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·40 cites·20 claims
- 0598US10032606B2Semiconductor processing with DC assisted RF power for improved controlAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·94 cites·13 claims
- 0698US9991134B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jun 5, 2018·100 cites·17 claims
- 0798US9978564B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2015·Granted May 22, 2018·106 cites·13 claims
- 0898US9728437B2High temperature chuck for plasma processing systemsAPPLIED MATERIALS INC·Filed 2015·Granted Aug 8, 2017·123 cites·14 claims
- 0998US9704723B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·114 cites·17 claims
- 1098US9659792B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted May 23, 2017·125 cites·13 claims
- 1198US9496167B2Integrated bit-line airgap formation and gate stack post cleanAPPLIED MATERIALS INC·Filed 2014·Granted Nov 15, 2016·132 cites·5 claims
- 1298US9449850B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Sep 20, 2016·135 cites·18 claims
- 1398US9406523B2Highly selective doped oxide removal methodAPPLIED MATERIALS INC·Filed 2014·Granted Aug 2, 2016·135 cites·15 claims
- 1498US9378978B2Integrated oxide recess and floating gate fin trimmingAPPLIED MATERIALS INC·Filed 2014·Granted Jun 28, 2016·132 cites·15 claims
- 1598US9373517B2Semiconductor processing with DC assisted RF power for improved controlAPPLIED MATERIALS INC·Filed 2013·Granted Jun 21, 2016·137 cites·20 claims
- 1698US9362130B2Enhanced etching processes using remote plasma sourcesAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·138 cites·15 claims
- 1798US9209012B2Selective etch of silicon nitrideAPPLIED MATERIALS INC·Filed 2014·Granted Dec 8, 2015·173 cites·15 claims
- 1898US9184055B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 10, 2015·181 cites·20 claims
- 1998US9153442B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Oct 6, 2015·220 cites·13 claims
- 2098US9132436B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2013·Granted Sep 15, 2015·198 cites·19 claims
- 2198US9093371B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·184 cites·17 claims
- 2298US9023732B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted May 5, 2015·187 cites·14 claims
- 2398US8956980B1Selective etch of silicon nitrideAPPLIED MATERIALS INC·Filed 2013·Granted Feb 17, 2015·226 cites·15 claims
- 2498US8435902B2Invertable pattern loading with dry etchTANG JING·Filed 2010·Granted May 7, 2013·227 cites·13 claims
- 2597US10256079B2Semiconductor processing systems having multiple plasma configurationsAPPLIED MATERIALS INC·Filed 2013·Granted Apr 9, 2019·42 cites·23 claims
- 2697US8759223B2Double patterning etching processSAPRE KEDAR·Filed 2012·Granted Jun 24, 2014·467 cites·20 claims
- 2797US8741788B2Formation of silicon oxide using non-carbon flowable CVD processesLIANG JINGMEI·Filed 2010·Granted Jun 3, 2014·61 cites·17 claims
- 2897US7902080B2Deposition-plasma cure cycle process to enhance film quality of silicon dioxideAPPLIED MATERIALS INC·Filed 2007·Granted Mar 8, 2011·55 cites·30 claims
- 2997US6537733B2Method of depositing low dielectric constant silicon carbide layersAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·292 cites·90 claims
- 3097US6387207B1Integration of remote plasma generator with semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted May 14, 2002·944 cites·21 claims
- 3197US6374831B1Accelerated plasma cleanAPPLIED MATERIALS INC·Filed 1999·Granted Apr 23, 2002·642 cites·15 claims
- 3296US8894767B2Flow control features of CVD chambersCHUC KIEN N·Filed 2010·Granted Nov 25, 2014·107 cites·16 claims
- 3396US8664127B2Two silicon-containing precursors for gapfill enhancing dielectric linerBHATIA SIDHARTH·Filed 2011·Granted Mar 4, 2014·480 cites·19 claims
- 3496US7994019B1Silicon-ozone CVD with reduced pattern loading using incubation period depositionAPPLIED MATERIALS INC·Filed 2010·Granted Aug 9, 2011·40 cites·19 claims
- 3596US7500445B2Method and apparatus for cleaning a CVD chamberAPPLIED MATERIALS INC·Filed 2003·Granted Mar 10, 2009·187 cites·2 claims
- 3696US6946033B2Heated gas distribution plate for a processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Sep 20, 2005·227 cites·17 claims
- 3796US6890850B2Method of depositing dielectric materials in damascene applicationsAPPLIED MATERIALS INC·Filed 2002·Granted May 10, 2005·92 cites·27 claims
- 3896US6591850B2Method and apparatus for fluid flow controlAPPLIED MATERIALS INC·Filed 2001·Granted Jul 15, 2003·68 cites·28 claims
- 3996US6486082B1CVD plasma assisted lower dielectric constant sicoh filmAPPLIED MATERIALS INC·Filed 2001·Granted Nov 26, 2002·80 cites·30 claims
- 4095US8304351B2In-situ ozone cure for radical-component CVDWANG LINLIN·Filed 2010·Granted Nov 6, 2012·26 cites·18 claims
- 4195US8114761B2Method for doping non-planar transistorsMANDREKAR TUSHAR V·Filed 2010·Granted Feb 14, 2012·136 cites·10 claims
- 4295US7935643B2Stress management for tensile filmsAPPLIED MATERIALS INC·Filed 2009·Granted May 3, 2011·48 cites·9 claims
- 4394US10319649B2Optical emission spectroscopy (OES) for remote plasma monitoringAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·8 cites·18 claims
- 4494US10283321B2Semiconductor processing system and methods using capacitively coupled plasmaYANG JANG GYOO·Filed 2011·Granted May 7, 2019·39 cites·15 claims
- 4594US7226876B2Method of modifying interlayer adhesionAPPLIED MATERIALS INC·Filed 2005·Granted Jun 5, 2007·14 cites·7 claims
- 4693US11594428B2Low temperature chuck for plasma processing systemsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 28, 2023·9 cites·16 claims
- 4793US8466067B2Post-planarization densificationLIANG JINGMEI·Filed 2011·Granted Jun 18, 2013·19 cites·19 claims
- 4893US8236708B2Reduced pattern loading using bis(diethylamino)silane (C8H22N2Si) as silicon precursorKWESKIN SASHA·Filed 2010·Granted Aug 7, 2012·27 cites·14 claims
- 4993US7334741B2Fuel injector with injection rate controlCUMMINS INC·Filed 2005·Granted Feb 26, 2008·22 cites·20 claims
- 5093US6797643B2Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF powerAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·84 cites·24 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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