Inventor · disambiguated record
Jong-Joo Lee
Also filed as: LEE JONG-JOO
51 granted patents·15 pending applications·545 citations·filing 2004–2025
98Inventor score
Top patents by PatentIndex Score
66 records- 0199US7768115B2Stack chip and stack chip package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 3, 2010·275 cites·20 claims
- 0297US7317247B2Semiconductor package having heat spreader and package stack using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 8, 2008·31 cites·62 claims
- 0395US8471362B2Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor deviceLEE JONG-JOO·Filed 2011·Granted Jun 25, 2013·25 cites·18 claims
- 0495US7675181B2Planar multi semiconductor chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 9, 2010·36 cites·18 claims
- 0591US9391048B2Semiconductor packageLEE JONG-JOO·Filed 2014·Granted Jul 12, 2016·12 cites·25 claims
- 0686US8319351B2Planar multi semiconductor chip packageLEE JONG-JOO·Filed 2010·Granted Nov 27, 2012·7 cites·26 claims
- 0785US7462930B2Stack chip and stack chip package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 9, 2008·18 cites·20 claims
- 0884US7745922B2Package board having internal terminal interconnection and semiconductor package employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 29, 2010·10 cites·23 claims
- 0983US7821127B2Semiconductor device package having buffered memory module and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 26, 2010·10 cites·20 claims
- 1082US10381334B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 13, 2019·3 cites·13 claims
- 1182US7964948B2Chip stack, chip stack package, and method of forming chip stack and chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 21, 2011·10 cites·66 claims
- 1282US7274097B2Semiconductor package including redistribution pattern and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 25, 2007·11 cites·41 claims
- 1381US8643178B2Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the sameLEE JONG-JOO·Filed 2013·Granted Feb 4, 2014·5 cites·12 claims
- 1481US8120176B2Semiconductor device having a conductive bumpSHIN DONG-KIL·Filed 2010·Granted Feb 21, 2012·8 cites·19 claims
- 1581US2025259693A1Memory system including a sub-controller and operating method of the sub-controllerSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1680US12347509B2Memory system including a sub-controller and operating method of the sub-controllerSK HYNIX INC·Filed 2024·Granted Jul 1, 2025·0 cites·9 claims
- 1778US8633579B2Multi-chip package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2011·Granted Jan 21, 2014·4 cites·14 claims
- 1877US7586182B2Packaged semiconductor die and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 8, 2009·7 cites·20 claims
- 1976USRE46666EPackage board having internal terminal interconnection and semiconductor package employing the sameLEE JONG-JOO·Filed 2014·Granted Jan 9, 2018·3 cites·72 claims
- 2076US9400950B2Integrated circuit card socket having a terminal with a loop-shaped portionSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 26, 2016·2 cites·20 claims
- 2176US8884421B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·3 cites·10 claims
- 2275US8125068B2Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chipLEE JONG-JOO·Filed 2009·Granted Feb 28, 2012·5 cites·16 claims
- 2373US8625938B2Electronic device having optical communicating partLEE JONG-JOO·Filed 2012·Granted Jan 7, 2014·3 cites·20 claims
- 2472US8039928B2Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 18, 2011·4 cites·37 claims
- 2572US7545037B2Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·7 cites·15 claims
- 2671US8097940B2Stack packageBAEK SEUNG-DUK·Filed 2009·Granted Jan 17, 2012·5 cites·15 claims
- 2771US7064444B2Multi-chip ball grid array packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 20, 2006·21 cites·34 claims
- 2870US8604616B2Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chipLEE JONG-JOO·Filed 2012·Granted Dec 10, 2013·2 cites·15 claims
- 2969US11901027B2Memory system including a sub-controller and operating method of the sub-controllerSK HYNIX INC·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 3069US8410611B2Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the sameLEE JONG-JOO·Filed 2012·Granted Apr 2, 2013·1 cites·20 claims
- 3168US8853854B2Semiconductor package and method of manufacturing the sameLEE JONG-JOO·Filed 2011·Granted Oct 7, 2014·2 cites·17 claims
- 3268US8796847B2Package substrate having main dummy pattern located in path of stressLEE JONG-JOO·Filed 2011·Granted Aug 5, 2014·2 cites·18 claims
- 3367US2024395292A1Storage device based on daisy chain topologySK HYNIX INC·Filed 2024·Application pending·0 cites
- 3466US8309372B2Method of manufacturing stacked semiconductor packageLEE JONG-JOO·Filed 2011·Granted Nov 13, 2012·2 cites·10 claims
- 3565US8115315B2Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the sameLEE JONG-JOO·Filed 2009·Granted Feb 14, 2012·1 cites·21 claims
- 3664US10461033B2Semiconductor memory packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·1 cites·20 claims
- 3764US8178969B2Flip chip packageLEE JONG-JOO·Filed 2009·Granted May 15, 2012·2 cites·19 claims
- 3863US8446016B2Chip stack packageKANG SUN-WON·Filed 2011·Granted May 21, 2013·1 cites·39 claims
- 3961US12087390B2Storage device based on daisy chain topologySK HYNIX INC·Filed 2022·Granted Sep 10, 2024·0 cites·9 claims
- 4059US8044302B2Printed circuit board having coplanar LC balanceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 25, 2011·1 cites·19 claims
- 4159US8004081B2Semiconductor chip package and printed circuit board having through interconnectionsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 23, 2011·1 cites·19 claims
- 4258US7652383B2Semiconductor package module without a solder ball and method of manufacturing the semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·1 cites·8 claims
- 4357US10971486B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 4454US10128191B2Package-on-package type package including integrated circuit devices and associated passive components on different levelsLEE JONG JOO·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
- 4553US12444708B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2022·Granted Oct 14, 2025·0 cites·18 claims
- 4652US9679853B2Package-on-package type package including integrated circuit devices and associated passive components on different levelsLEE JONG-JOO·Filed 2013·Granted Jun 13, 2017·0 cites·13 claims
- 4752US8723315B2Flip chip packageLEE JONG-JOO·Filed 2012·Granted May 13, 2014·0 cites·14 claims
- 4852US8061024B2Method of fabricating a circuit board and semiconductor package.LEE JONG-JOO·Filed 2008·Granted Nov 22, 2011·1 cites·20 claims
- 4950US11569109B2Wafer cassette stocker and wafer cassette drying method using the sameSK SILTRON CO LTD·Filed 2018·Granted Jan 31, 2023·0 cites·9 claims
- 5049US2007176268A1Socketless planar semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jong-Joo Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →