Inventor · disambiguated record
Noboru Hayasaka
Also filed as: HAYASAKA NOBORU
26 granted patents·9 pending applications·119 citations·filing 1994–2025
95Inventor score
Files withYAZAKI CORP21FUJITSU LTD8FUJITSU MICROELECTRONICS LTD2FUJITSU SEMICONDUCTOR LTD2SANYO ELECTRIC CO2
Top patents by PatentIndex Score
35 records- 0185US7395847B2Jig for a semiconductor substrateFUJITSU LTD·Filed 2005·Granted Jul 8, 2008·9 cites·3 claims
- 0284US10461480B1Shield connectorYAZAKI CORP·Filed 2019·Granted Oct 29, 2019·7 cites·6 claims
- 0381US10069241B2Fitting connectorYAZAKI CORP·Filed 2018·Granted Sep 4, 2018·5 cites·4 claims
- 0481US10027054B2Connector having integrated housing and shield shellYAZAKI CORP·Filed 2017·Granted Jul 17, 2018·6 cites·6 claims
- 0578US10505319B2Device direct-mounting shield connectorYAZAKI CORP·Filed 2018·Granted Dec 10, 2019·4 cites·7 claims
- 0676US2025364738A1Terminal Connection StructureYAZAKI CORP·Filed 2025·Application pending·0 cites
- 0774US7109561B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2005·Granted Sep 19, 2006·4 cites·1 claims
- 0874US2025364737A1Terminal Connection StructureYAZAKI CORP·Filed 2025·Application pending·0 cites
- 0973US6750074B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2002·Granted Jun 15, 2004·13 cites·12 claims
- 1072US10971854B2Shielded connectorYAZAKI CORP·Filed 2019·Granted Apr 6, 2021·3 cites·1 claims
- 1172US8009222B2Image pickup apparatus and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Aug 30, 2011·3 cites·2 claims
- 1271US7638367B2Method of resin sealing electronic partFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Dec 29, 2009·4 cites·10 claims
- 1371US7571538B2Vacuum fixing jig for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Aug 11, 2009·3 cites·1 claims
- 1470US2025253590A1Shield connectorYAZAKI CORP·Filed 2025·Application pending·0 cites
- 1569US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 1668US2025260188A1TerminalYAZAKI CORP·Filed 2025·Application pending·0 cites
- 1764US10847918B2Fitting connectorYAZAKI CORP·Filed 2019·Granted Nov 24, 2020·2 cites·16 claims
- 1860US7923303B2Method of resin sealing electronic partFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted Apr 12, 2011·1 cites·6 claims
- 1959US6902944B2Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jigFUJITSU LTD·Filed 2004·Granted Jun 7, 2005·5 cites·4 claims
- 2058US11121501B2Connector having structure for separating connector from connection targetYAZAKI CORP·Filed 2019·Granted Sep 14, 2021·1 cites·7 claims
- 2156US2024235128A1Vehicle display deviceYAZAKI CORP·Filed 2024·Application pending·0 cites
- 2255US11005216B2Connector and connector structureYAZAKI CORP·Filed 2019·Granted May 11, 2021·1 cites·10 claims
- 2355US7157311B2Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devicesFUJITSU LTD·Filed 2003·Granted Jan 2, 2007·5 cites·15 claims
- 2455US2024213691A1Connector and terminal connection methodYAZAKI CORP·Filed 2024·Application pending·0 cites
- 2553US12266882B2Connector including terminal fitting embedded in housing and manufacturing method of connector including terminal fitting embedded in housingYAZAKI CORP·Filed 2022·Granted Apr 1, 2025·0 cites·4 claims
- 2648US2007065653A1Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devicesFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2746US11005208B2Connector and wire harnessYAZAKI CORP·Filed 2019·Granted May 11, 2021·0 cites·10 claims
- 2846US6951800B2Method of making semiconductor device that has improved structural strengthFUJITSU LTD·Filed 2002·Granted Oct 4, 2005·1 cites·1 claims
- 2946US2021273374A1ConnectorYAZAKI CORP·Filed 2021·Application pending·0 cites
- 3045US10236639B2Attachment structure of shield connector for directly mounting on deviceYAZAKI CORP·Filed 2018·Granted Mar 19, 2019·0 cites·4 claims
- 3139US10770834B2Fitting connectorYAZAKI CORP·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 3239US2020144769A1Fitting connectorYAZAKI CORP·Filed 2019·Application pending·0 cites
- 3338US10044149B2Female and male connectorsYAZAKI CORP·Filed 2017·Granted Aug 7, 2018·0 cites·7 claims
- 3433US5430844ACommunication control system for transmitting, from one data processing device to another, data along with an identification of the address at which the data is to be stored upon receptionSANYO ELECTRIC CO·Filed 1994·Granted Jul 4, 1995·13 cites·4 claims
- 3532US5588120ACommunication control system for transmitting, from one data processing device to another, data of different formats along with an identification of the format and its corresponding DMA controllerSANYO ELECTRIC CO·Filed 1995·Granted Dec 24, 1996·10 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →