Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Abstract

A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

1 . A substrate sheet material in which a plurality of substrates to be used for producing semiconductor packages are formed, wherein an outer configuration of the substrate sheet material is made into a circular shape.  
     
     
         2 . The substrate sheet material as claimed in  claim 1 , wherein a through opening is provided at a center of the substrate sheet material.  
     
     
         3 . The substrate sheet material as claimed in  claim 1 , wherein at least one through hole is provided in an area other than an area where the substrates are formed.  
     
     
         4 . The substrate sheet material as claimed in  claim 3 , wherein a plurality of the through holes are provided and arranged along a circumference of the area where the substrates are formed.  
     
     
         5 . A substrate sheet material in which a plurality of substrates to be used for producing semiconductor packages are formed, wherein at least one through hole is provided outside an area where the substrates are formed and within an area where a resin mold is formed.  
     
     
         6 . The substrate sheet material as claimed in  claim 5 , wherein a plurality of the through holes are provided and arranged along a circumference of the area where the substrates are formed.