Inventor · disambiguated record
Tom C. Lee
Also filed as: LEE TOM C
75 granted patents·5 pending applications·743 citations·filing 2003–2019
99Inventor score
Top patents by PatentIndex Score
80 records- 0199US7786535B2Design structures for high-voltage integrated circuitsIBM·Filed 2008·Granted Aug 31, 2010·249 cites·14 claims
- 0299US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0395US8021950B1Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formationIBM·Filed 2010·Granted Sep 20, 2011·20 cites·20 claims
- 0494US8563336B2Method for forming thin film resistor and terminal bond pad simultaneouslyCHEN FEN·Filed 2008·Granted Oct 22, 2013·18 cites·16 claims
- 0594US8445355B2Metal-insulator-metal capacitors with high capacitance densityABOU-KHALIL MICHEL J·Filed 2010·Granted May 21, 2013·18 cites·22 claims
- 0694US7166913B2Heat dissipation for heat generating element of semiconductor device and related methodIBM·Filed 2005·Granted Jan 23, 2007·34 cites·15 claims
- 0793US7892926B2Fuse link structures using film stress for programming and methods of manufactureIBM·Filed 2009·Granted Feb 22, 2011·21 cites·19 claims
- 0892US8841174B1Silicon controlled rectifier with integral deep trench capacitorIBM·Filed 2013·Granted Sep 23, 2014·12 cites·8 claims
- 0992US8089105B2Fuse link structures using film stress for programming and methods of manufactureBARTH KARL W·Filed 2010·Granted Jan 3, 2012·14 cites·20 claims
- 1091US8236655B2Fuse link structures using film stress for programming and methods of manufactureBARTH KARL W·Filed 2010·Granted Aug 7, 2012·12 cites·17 claims
- 1190US8637388B2Semiconductor device heat dissipation structureIBM·Filed 2013·Granted Jan 28, 2014·12 cites·20 claims
- 1289US8760831B2Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structuresIBM·Filed 2013·Granted Jun 24, 2014·6 cites·20 claims
- 1388US9391065B1Electrostatic discharge and passive structures integrated in a vertical gate fin-type field effect diodeIBM·Filed 2015·Granted Jul 12, 2016·5 cites·7 claims
- 1487US7345503B2Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devicesIBM·Filed 2006·Granted Mar 18, 2008·13 cites·8 claims
- 1586US9006783B2Silicon controlled rectifier with integral deep trench capacitorIBM·Filed 2014·Granted Apr 14, 2015·6 cites·8 claims
- 1685US9064786B2Dual three-dimensional (3D) resistor and methods of formingIBM·Filed 2013·Granted Jun 23, 2015·7 cites·10 claims
- 1784US8686508B2Structures, methods and applications for electrical pulse anneal processesABOU-KHALIL MICHEL J·Filed 2009·Granted Apr 1, 2014·5 cites·9 claims
- 1883US9831194B1Edge compression layersGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 28, 2017·4 cites·20 claims
- 1983US8891212B2RC-triggered semiconductor controlled rectifier for ESD protection of signal padsABOU-KHALIL MICHEL J·Filed 2011·Granted Nov 18, 2014·7 cites·24 claims
- 2082US9413169B2Electrostatic discharge protection circuit with a fail-safe mechanismGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 9, 2016·4 cites·20 claims
- 2182US9240471B2SCR with fin body regions for ESD protectionIBM·Filed 2013·Granted Jan 19, 2016·5 cites·16 claims
- 2282US8101505B2Programmable electrical fuseABOU-KHALIL MICHEL J·Filed 2008·Granted Jan 24, 2012·9 cites·13 claims
- 2381US8669146B2Semiconductor structures with thinned junctions and methods of manufactureABOU-KHALIL MICHEL J·Filed 2011·Granted Mar 11, 2014·5 cites·15 claims
- 2481US8592941B2Fuse structure having crack stop void, method for forming and programming same, and design structureGAMBINO JEFFREY P·Filed 2010·Granted Nov 26, 2013·6 cites·20 claims
- 2580US8890249B2Bulk FinFET ESD deviceIBM·Filed 2012·Granted Nov 18, 2014·4 cites·7 claims
- 2679US8610249B2Non-planar capacitor and method of forming the non-planar capacitorDI SARRO JAMES P·Filed 2012·Granted Dec 17, 2013·5 cites·19 claims
- 2777US8503140B2Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structuresABOU-KHALIL MICHEL J·Filed 2010·Granted Aug 6, 2013·3 cites·15 claims
- 2874US8765595B2Thick on-chip high-performance wiring structuresCOONEY III EDWARD C·Filed 2012·Granted Jul 1, 2014·3 cites·16 claims
- 2973US9070629B2Through silicon via repairIBM·Filed 2013·Granted Jun 30, 2015·2 cites·6 claims
- 3072US7890893B2Design structure for semiconductor on-chip repair scheme for negative bias temperature instabilityIBM·Filed 2008·Granted Feb 15, 2011·5 cites·19 claims
- 3171US9287345B2Semiconductor structure with thin film resistor and terminal bond padIBM·Filed 2013·Granted Mar 15, 2016·2 cites·19 claims
- 3271US8586466B2Electrical fuse with a current shuntLEE TOM C·Filed 2010·Granted Nov 19, 2013·4 cites·11 claims
- 3371US8562210B2Thermal sensor for semiconductor circuitsCHRISTIANSEN CATHRYN J·Filed 2010·Granted Oct 22, 2013·4 cites·14 claims
- 3471US7838958B2Semiconductor on-chip repair scheme for negative bias temperature instabilityIBM·Filed 2008·Granted Nov 23, 2010·3 cites·7 claims
- 3570US7768815B2Optoelectronic memory devicesIBM·Filed 2005·Granted Aug 3, 2010·5 cites·13 claims
- 3670US7639032B2Structure for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2007·Granted Dec 29, 2009·2 cites·7 claims
- 3769US9704852B2Electrostatic discharge and passive structures integrated in a vertical gate fin-type field effect diodeGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 11, 2017·1 cites·14 claims
- 3869US9425185B2Self-healing electrostatic discharge power clampGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 23, 2016·2 cites·16 claims
- 3969US8737028B2RC-triggered ESD clamp device with feedback for time constant adjustmentDI SARRO JAMES P·Filed 2011·Granted May 27, 2014·2 cites·18 claims
- 4068US8003536B2Electromigration resistant aluminum-based metal interconnect structureIBM·Filed 2009·Granted Aug 23, 2011·2 cites·7 claims
- 4167US8421128B2Semiconductor device heat dissipation structureABOU-KHALIL MICHEL J·Filed 2007·Granted Apr 16, 2013·3 cites·19 claims
- 4267US7881028B2E-fuse used to disable a triggering networkIBM·Filed 2008·Granted Feb 1, 2011·3 cites·15 claims
- 4366US10755949B2Structures, methods and applications for electrical pulse anneal processesIBM·Filed 2018·Granted Aug 25, 2020·0 cites·9 claims
- 4466US10109599B2Integrated circuit structure with continuous metal crack stopGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 23, 2018·1 cites·20 claims
- 4566US7981732B2Programming of laser fuseIBM·Filed 2008·Granted Jul 19, 2011·2 cites·8 claims
- 4665US8940588B2Bulk FinFET ESD devicesIBM·Filed 2014·Granted Jan 27, 2015·1 cites·10 claims
- 4765US8637353B2Through silicon via repairABOU-KHALIL MICHEL J·Filed 2011·Granted Jan 28, 2014·1 cites·5 claims
- 4865US2019198347A1Structures, methods and applications for electrical pulse anneal processesIBM·Filed 2019·Application pending·0 cites
- 4964US9685370B2Titanium tungsten liner used with copper interconnectsIBM·Filed 2014·Granted Jun 20, 2017·1 cites·19 claims
- 5064US8847354B2Metal-insulator-metal capacitors with high capacitance densityIBM·Filed 2013·Granted Sep 30, 2014·1 cites·7 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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