Inventor · disambiguated record
Eckhard Graf
Also filed as: GRAF ECKHARD
21 granted patents·3 pending applications·368 citations·filing 1994–2019
95Inventor score
Top patents by PatentIndex Score
24 records- 0193US6406979B2Method for sectioning a substrate wafer into a plurality of substrate chipsBOSCH GMBH ROBERT·Filed 2001·Granted Jun 18, 2002·72 cites·11 claims
- 0286US6951824B2Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the methodBOSCH GMBH ROBERT·Filed 2000·Granted Oct 4, 2005·46 cites·11 claims
- 0386US5937275AMethod of producing acceleration sensorsBOSCH GMBH ROBERT·Filed 1996·Granted Aug 10, 1999·67 cites·12 claims
- 0478US8748998B2Sensor moduleFREY JENS·Filed 2011·Granted Jun 10, 2014·4 cites·8 claims
- 0578US6876048B2Micromechanical component as well as a method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2002·Granted Apr 5, 2005·22 cites·18 claims
- 0676US6465854B1Micromechanical componentBOSCH GMBH ROBERT·Filed 1998·Granted Oct 15, 2002·36 cites·9 claims
- 0776US5465758AApparatus for sealing leakage points in pipes from the inside of the pipe, and a method of sealing the leakage pointsUHRIG KANALTECHNIK GMBH·Filed 1994·Granted Nov 14, 1995·49 cites·14 claims
- 0871US7153718B2Micromechanical component as well as a method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2004·Granted Dec 26, 2006·14 cites·8 claims
- 0967US6140709ABonding pad structure and method for manufacturing the bonding pad structureBOSCH GMBH ROBERT·Filed 1999·Granted Oct 31, 2000·26 cites·24 claims
- 1056US8174082B2Micromechanical component having multiple caverns, and manufacturing methodFISCHER FRANK·Filed 2005·Granted May 8, 2012·2 cites·21 claims
- 1156US6955975B2Method for joining a silicon plate to a second plateBOSCH GMBH ROBERT·Filed 2002·Granted Oct 18, 2005·7 cites·8 claims
- 1253US5769459AInside sealing device sleeve for insertion of pipesUHRIG KANALTECHNIK GMBH·Filed 1996·Granted Jun 23, 1998·22 cites·5 claims
- 1351US11261082B2Micromechanical device and method for manufacturing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2019·Granted Mar 1, 2022·0 cites·11 claims
- 1449US8138006B2Method for producing a micromechanical component having a trench structure for backside contactSCHEUERER ROLAND·Filed 2008·Granted Mar 20, 2012·0 cites·5 claims
- 1547US8419957B2Method for producing a micromechanical component having a filler layer and a masking layerSCHEUERER ROLAND·Filed 2008·Granted Apr 16, 2013·0 cites·18 claims
- 1646US8587095B2Method for establishing and closing a trench of a semiconductor componentREINMUTH JOCHEN·Filed 2011·Granted Nov 19, 2013·0 cites·16 claims
- 1746US8564078B2Method for producing a micromechanical component having a trench structure for backside contactSCHEUERER ROLAND·Filed 2011·Granted Oct 22, 2013·0 cites·8 claims
- 1844US8975118B2Component having a via and method for manufacturing itGONSKA JULIAN·Filed 2011·Granted Mar 10, 2015·0 cites·5 claims
- 1943US10752498B2MEMS component having two different internal pressuresBOSCH GMBH ROBERT·Filed 2016·Granted Aug 25, 2020·0 cites·12 claims
- 2043US7294894B2Micromechanical cap structure and a corresponding production methodBOSCH GMBH ROBERT·Filed 2002·Granted Nov 13, 2007·1 cites·6 claims
- 2143US2015137329A1Component having a via and method for manufacturing itBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 2240US8647961B2Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenchesFREY JENS·Filed 2011·Granted Feb 11, 2014·0 cites·10 claims
- 2339US2005112843A1Method for anodic bonding of wafers and deviceFiled 2004·Application pending·0 cites
- 2431US2005253240A1Micromechanical component and corresponsing production methodNUECHTER WOLFGANG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →