Component having a via and method for manufacturing it

Abstract

An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

1 - 14 . (canceled) 
     
     
         15 . A component, whose functionality is realized in a layer construction on a conductive substrate, comprising:
 a component arrangement having at least one via (Vertical Interconnect Access), led to a back side of the component arrangement, for electrically contacting functional elements realized in the layer construction,   wherein the at least one via includes a connection area in the substrate that extends over the entire thickness of the substrate, and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness, and   wherein the trench-like insulating frame is filled up with an electrically insulating polymer.   
     
     
         16 . A component, comprising:
 functional elements, which are realized in a layer construction on a substrate;   a conductive cap substrate on the layer construction; and   at least one via (Vertical Interconnect Access), led through the cap substrate, for electrically contacting the functional elements, the via including a connection area that extends over the entire thickness of the cap substrate up to a connecting conductor track in the layer construction on the substrate, and being electrically insulated from its surroundings by a trench-like insulating frame, and the trench-like insulating frame being filled up with an electrically insulating polymer.   
     
     
         17 . The component of  claim 15 , wherein the filling of the insulating frame includes at least one of BCB (benzocyclobutene), a polyimide and PBO (polyphenylene-2,6-benzobisoxazole). 
     
     
         18 . The component of  claim 15 , wherein a filler, including at least one of SiO2 nanoparticles and metal oxide particles, is added to the polymer filling of the insulating frame. 
     
     
         19 . The component of  claim 15 , wherein the insulating frame of the via has a rounded geometry, which is cylindrical. 
     
     
         20 . The component of  claim 15 , wherein the cross section of the insulating frame is expanded in at least one of the middle area and the base area compared to its cross section in the upper area.