Inventor · disambiguated record
Chi Yuam Chung
Also filed as: CHUNG CHI Y · CHUNG CHI YUAM
1 granted patent·3 pending applications·0 citations·filing 2006–2008
8Inventor score
Top patents by PatentIndex Score
4 records- 0136US7749866B2Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tapeADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jul 6, 2010·0 cites·15 claims
- 0230US2007224780A1Method for dicing a waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0326US2008045124A1Sawing method for a waferCHU FU-TANG·Filed 2007·Application pending·0 cites
- 0425US2006281282A1Method for maching a waferCHU FU T·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →