Inventor · disambiguated record
Yong Bo Yang
Also filed as: YANG YONG BO
3 granted patents·1 pending application·6 citations·filing 2012–2015
57Inventor score
Files withDIMAANO JR ANTONIO BAMBALAN1UNITED TEST & ASSEMBLY CT LT1UNITED TEST AND ASSEMBLY CENTER LTD1UTAC HEADQUARTERS PTE LTD1
Top patents by PatentIndex Score
4 records- 0180US9165878B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Oct 20, 2015·6 cites·25 claims
- 0246US9472532B2Leadframe area array packaging technologyUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted Oct 18, 2016·0 cites·24 claims
- 0345US2016043041A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Application pending·0 cites
- 0443US9023690B2Leadframe area array packaging technologyDIMAANO JR ANTONIO BAMBALAN·Filed 2012·Granted May 5, 2015·0 cites·23 claims
Join the waitlist — get patent alerts
Get an alert when Yong Bo Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →