Inventor · disambiguated record
Terumasa Moriyama
Also filed as: MORIYAMA TERUMASA
7 granted patents·7 pending applications·44 citations·filing 2009–2018
82Inventor score
Top patents by PatentIndex Score
14 records- 0188US10123433B2Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Nov 6, 2018·9 cites·24 claims
- 0285US9028972B2Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring boardKOHIKI MICHIYA·Filed 2011·Granted May 12, 2015·4 cites·13 claims
- 0385US8142905B2Copper foil for printed circuit board and copper clad laminate for printed circuit boardMORIYAMA TERUMASA·Filed 2009·Granted Mar 27, 2012·22 cites·16 claims
- 0483US9578741B2Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2013·Granted Feb 21, 2017·4 cites·17 claims
- 0581US10332756B2Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jun 25, 2019·4 cites·17 claims
- 0677US9788423B2Copper foil with carrierJX NIPPON MINING & METALS CORP·Filed 2016·Granted Oct 10, 2017·1 cites·1 claims
- 0744US2019240729A1Surface treatment metal powder for laser sinteringJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 0843US11401612B2Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatusJX NIPPON MINING & METALS CORP·Filed 2018·Granted Aug 2, 2022·0 cites·19 claims
- 0942US2018264783A1Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring BoardJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1042US2013189538A1Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring boardMORIYAMA TERUMASA·Filed 2011·Application pending·0 cites
- 1141US2016374205A1Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devicesJX NIPPON MINING & METALS CORP·Filed 2016·Application pending·0 cites
- 1241US2012148862A1Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit BoardMORIYAMA TERUMASA·Filed 2012·Application pending·0 cites
- 1339US2018255646A1Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic ApparatusJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 1433US2014030591A1Electrolytic copper foil for an anode of a negative electrode collector in a secondary battery and method of producing the sameKOHIKI MICHIYA·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Terumasa Moriyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →