Assignee
MORIYAMA TERUMASA
JP·1 granted patent·2 pending applications·22 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0185US8142905B2Copper foil for printed circuit board and copper clad laminate for printed circuit boardMORIYAMA TERUMASA·Filed 2009·Granted Mar 27, 2012·22 cites·16 claims
- 0242US2013189538A1Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring boardMORIYAMA TERUMASA·Filed 2011·Application pending·0 cites
- 0341US2012148862A1Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit BoardMORIYAMA TERUMASA·Filed 2012·Application pending·0 cites
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