Inventor · disambiguated record
Te-Chi Wong
Also filed as: WONG TE-CHI
11 granted patents·13 pending applications·46 citations·filing 2004–2025
87Inventor score
Top patents by PatentIndex Score
24 records- 0195US11908764B2Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0291US2025349644A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0390US7804023B2Bifacial thin film solar cell and method for making the sameIND TECH RES INST·Filed 2007·Granted Sep 28, 2010·17 cites·13 claims
- 0487US2025105080A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0586US12444663B2Semiconductor package including a semiconductor die disposed in a cavity and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0685US7279401B2Fabricating method for flexible thin film transistor array substrateIND TECH RES INST·Filed 2006·Granted Oct 9, 2007·14 cites·13 claims
- 0783US12205861B2Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0882US8344245B2Thin film solar cell module of see-through typeIND TECH RES INST·Filed 2011·Granted Jan 1, 2013·3 cites·8 claims
- 0980US7982127B2Thin film solar cell module of see-through typeIND TECH RES INST·Filed 2008·Granted Jul 19, 2011·5 cites·8 claims
- 1078US7591066B2Clamping device for flexible substrateIND TECH RES INST·Filed 2006·Granted Sep 22, 2009·5 cites·8 claims
- 1163US2025112166A1Flip chip package and fabrication method thereofMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1259US2024243098A1Semiconductor package and fabrication method thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1359US2025174576A1Semiconductor package and fabrication method thereofMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1459US2024178159A1Coreless substrate package and fabrication method thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1557US8011085B2Method for fabricating clamping device for flexible substrateIND TECH RES INST·Filed 2009·Granted Sep 6, 2011·0 cites·4 claims
- 1657US7926170B2Method for fabricating a clamping device for flexible substrateIND TECH RES INST·Filed 2009·Granted Apr 19, 2011·0 cites·4 claims
- 1753US8029890B2Structure of thermal resistive layer and the method of forming the sameIND TECH RES INST·Filed 2009·Granted Oct 4, 2011·0 cites·12 claims
- 1853US2009155988A1Element of low temperature poly-silicon thin film and method of making poly-silicon thin film by direct deposition at low temperature and inductively-coupled plasma chemical vapor deposition equipment thereforIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1948US2007077735A1Element of low temperature poly-silicon thin film and method of making poly-silicon thin film by direct deposition at low temperature and inductively-coupled plasma chemical vapor deposition equipment thereforIND TECH RES INST·Filed 2006·Application pending·0 cites
- 2047US2009277500A1Transparent solar cell moduleIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2144US2011297550A1Method of forming the structure of thermal resistive layerCHANG JUNG-FANG·Filed 2011·Application pending·0 cites
- 2241US2007026647A1Method for forming polycrystalline silicon thin filmIND TECH RES INST·Filed 2005·Application pending·0 cites
- 2338US2006093807A1Structure of thermal resistive layer and the method of forming the sameIND TECH RES INST·Filed 2004·Application pending·0 cites
- 2437US2007254399A1Low temperature direct deposited polycrystalline silicon thin film transistor structure and method for manufacturing the sameIND TECH RES INST·Filed 2006·Application pending·0 cites
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