Inventor · disambiguated record
Sum-Yee Betty Tang
Also filed as: TANG SUM-YEE · TANG SUM-YEE B · TANG SUM-YEE BETTY
6 granted patents·6 pending applications·462 citations·filing 1998–2013
85Inventor score
Top patents by PatentIndex Score
12 records- 0193US7407893B2Liquid precursors for the CVD deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·33 cites·20 claims
- 0293US6762127B2Etch process for dielectric materials comprising oxidized organo silane materialsFiled 2001·Granted Jul 13, 2004·320 cites·28 claims
- 0384US6380096B2In-situ integrated oxide etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 1998·Granted Apr 30, 2002·96 cites·24 claims
- 0477US7776516B2Graded ARC for high NA and immersion lithographyAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·4 cites·14 claims
- 0561US6664202B2Mixed frequency high temperature nitride CVD processAPPLIED MATERIALS INC·Filed 2002·Granted Dec 16, 2003·9 cites·16 claims
- 0659US2014091379A1Fluorocarbon coating having low refractive indexAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 0759US2014091417A1Low refractive index coating deposited by remote plasma cvdAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 0851US2007207275A1Enhancement of remote plasma source clean for dielectric filmsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 0951US2007286954A1Methods for low temperature deposition of an amorphous carbon layerAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1046US2011151142A1Pecvd multi-step processing with continuous plasmaAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 1144US8125034B2Graded ARC for high NA and immersion lithographyYEH WENDY H·Filed 2010·Granted Feb 28, 2012·0 cites·11 claims
- 1236US2005170104A1Stress-tuned, single-layer silicon nitride filmAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →