Inventor · disambiguated record
Khalil Hosseini
Also filed as: HOSSEINI KHALIL
82 granted patents·8 pending applications·281 citations·filing 2003–2018
99Inventor score
Files withINFINEON TECHNOLOGIES AG42HOSSEINI KHALIL14INFINEON TECHNOLOGIES AUSTRIA10MAHLER JOACHIM8MENGEL MANFRED5
Top patents by PatentIndex Score
90 records- 0195US8884420B1Multichip deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 11, 2014·18 cites·20 claims
- 0292US8648456B1Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageMAHLER JOACHIM·Filed 2012·Granted Feb 11, 2014·13 cites·20 claims
- 0391US9190389B2Chip package with passivesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 17, 2015·13 cites·11 claims
- 0490US9048338B2Device including two power semiconductor chips and manufacturing thereofHOSSEINI KHALIL·Filed 2011·Granted Jun 2, 2015·12 cites·5 claims
- 0590US8778733B2Semiconductor package and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 15, 2014·11 cites·35 claims
- 0688US7642641B2Integrated circuit component with passivation layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 5, 2010·17 cites·11 claims
- 0787US7514778B2Power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 7, 2009·15 cites·14 claims
- 0885US8692361B2Electric device package comprising a laminate and method of making an electric device package comprising a laminateMAHLER JOACHIM·Filed 2012·Granted Apr 8, 2014·7 cites·17 claims
- 0985US8076238B2Electronic device and method for productionHOSSEINI KHALIL·Filed 2007·Granted Dec 13, 2011·9 cites·14 claims
- 1083US9021887B2Micromechanical semiconductor sensing deviceKALZ FRANZ-PETER·Filed 2011·Granted May 5, 2015·6 cites·3 claims
- 1183US7745913B2Power semiconductor component with a power semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 29, 2010·13 cites·12 claims
- 1281US7728415B2Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·10 cites·14 claims
- 1378US9420731B2Electronic power device and method of fabricating an electronic power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Aug 16, 2016·4 cites·12 claims
- 1478US8552571B2Electronic device and method for productionHOSSEINI KHALIL·Filed 2011·Granted Oct 8, 2013·3 cites·14 claims
- 1578US7632718B2Semiconductor power component with a vertical current path through a semiconductor power chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 15, 2009·8 cites·7 claims
- 1677US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 1777US9159701B2Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 13, 2015·4 cites·10 claims
- 1877US7709938B2Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 4, 2010·7 cites·5 claims
- 1976US9018744B2Semiconductor device having a clip contactINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 28, 2015·4 cites·26 claims
- 2075US9379050B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 28, 2016·4 cites·10 claims
- 2174US9171787B2Packaged semiconductor device having an embedded systemINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 27, 2015·3 cites·20 claims
- 2274US9093416B2Chip-package and a method for forming a chip-packageMENGEL MANFRED·Filed 2011·Granted Jul 28, 2015·4 cites·15 claims
- 2374US7834467B2Layer between interfaces of different components in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·6 cites·17 claims
- 2473US9305876B2Device including a semiconductor chip and wiresINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Apr 5, 2016·3 cites·19 claims
- 2573US8039971B2Electronic circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 18, 2011·4 cites·27 claims
- 2673US7874475B2Method for the planar joining of components of semiconductor devices and a diffusion joining structureINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 25, 2011·6 cites·20 claims
- 2772US8786111B2Semiconductor packages and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 22, 2014·3 cites·30 claims
- 2872US8569109B2Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging moduleMENGEL MANFRED·Filed 2011·Granted Oct 29, 2013·3 cites·29 claims
- 2972US7781897B2Semiconductor device and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 24, 2010·7 cites·12 claims
- 3071US8399996B2Chip carrierHOSSEINI KHALIL·Filed 2011·Granted Mar 19, 2013·2 cites·19 claims
- 3171US7368824B2Diffusion solder position, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 6, 2008·17 cites·15 claims
- 3270US8749075B2Integrated circuits and a method for manufacturing an integrated circuitMAHLER JOACHIM·Filed 2012·Granted Jun 10, 2014·3 cites·20 claims
- 3369US9790086B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·1 cites·2 claims
- 3469US9070568B2Chip package with embedded passive componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 30, 2015·2 cites·19 claims
- 3569US8872315B2Electronic device and method of fabricating an electronic deviceHOSSEINI KHALIL·Filed 2012·Granted Oct 28, 2014·2 cites·15 claims
- 3669US7880285B2Semiconductor device comprising a semiconductor chip stack and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·4 cites·20 claims
- 3768US8835219B2Device contact, electric device package and method of manufacturing an electric device packageMAHLER JOACHIM·Filed 2012·Granted Sep 16, 2014·2 cites·21 claims
- 3868US8824145B2Electric device package and method of making an electric device packageHOSSEINI KHALIL·Filed 2012·Granted Sep 2, 2014·2 cites·28 claims
- 3967US10153276B2Group III heterojunction semiconductor device having silicon carbide-containing lateral diodeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Dec 11, 2018·1 cites·18 claims
- 4067US8884434B2Method and system for improving reliability of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Nov 11, 2014·2 cites·15 claims
- 4167US8633600B2Device and method for manufacturing a deviceMENGEL MANFRED·Filed 2010·Granted Jan 21, 2014·2 cites·8 claims
- 4266US9406646B2Electronic device and method for fabricating an electronic deviceHOSSEINI KHALIL·Filed 2011·Granted Aug 2, 2016·2 cites·12 claims
- 4366US8531014B2Method and system for minimizing carrier stress of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Sep 10, 2013·2 cites·24 claims
- 4465US7851927B2Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection stripsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·3 cites·34 claims
- 4564US9313897B2Method for electrophoretically depositing a film on an electronic assemblyMAHLER JOACHIM·Filed 2012·Granted Apr 12, 2016·1 cites·14 claims
- 4663US9362240B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 4763US8283756B2Electronic component with buffer layerGALESIC IVAN·Filed 2007·Granted Oct 9, 2012·4 cites·18 claims
- 4862US9768120B2Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2012·Granted Sep 19, 2017·1 cites·8 claims
- 4961US9318473B2Semiconductor device including a polymer disposed on a carrierMAHLER JOACHIM·Filed 2012·Granted Apr 19, 2016·1 cites·25 claims
- 5061US9165792B2Integrated circuit, a chip package and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 20, 2015·1 cites·19 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →