Inventor · disambiguated record
Leonard W. Schaper
Also filed as: SCHAPER LEONARD · SCHAPER LEONARD W
21 granted patents·3 pending applications·1,008 citations·filing 1984–2013
97Inventor score
Files withUNIV ARKANSAS16AMERICAN TELEPHONE & TELEGRAPH2AT & T BELL LAB2KLING DENNIS R2ARKANSAS POWER ELECTRONICS INT INC1
Top patents by PatentIndex Score
24 records- 0198US6255600B1Electronic interconnection medium having offset electrical mesh planeUNIV ARKANSAS·Filed 1997·Granted Jul 3, 2001·244 cites·14 claims
- 0295US6516504B2Method of making capacitor with extremely wide band low impedanceUNIV ARKANSAS·Filed 1999·Granted Feb 11, 2003·134 cites·33 claims
- 0394US6388200B2Electronic interconnection medium having offset electrical mesh planeUNIV ARKANSAS·Filed 2001·Granted May 14, 2002·64 cites·58 claims
- 0494US6272003B1Floating plate capacitor with extremely wide band low impedanceUNIV ARKANSAS·Filed 2000·Granted Aug 7, 2001·69 cites·49 claims
- 0594US4577214ALow-inductance power/ground distribution in a package for a semiconductor chipAT & T BELL LAB·Filed 1984·Granted Mar 18, 1986·98 cites·4 claims
- 0691US9095054B1High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devicesARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Jul 28, 2015·19 cites·2 claims
- 0788US4675717AWater-scale-integrated assemblyAMERICAN TELEPHONE & TELEGRAPH·Filed 1984·Granted Jun 23, 1987·71 cites·32 claims
- 0887US6707680B2Surface applied passivesUNIV ARKANSAS·Filed 2002·Granted Mar 16, 2004·37 cites·10 claims
- 0983US5410107AMultichip moduleUNIV ARKANSAS·Filed 1993·Granted Apr 25, 1995·52 cites·21 claims
- 1082US5873992AMethod of electroplating a substrate, and products made therebyUNIV ARKANSAS·Filed 1997·Granted Feb 23, 1999·44 cites·12 claims
- 1175US6023408AFloating plate capacitor with extremely wide band low impedanceUNIV ARKANSAS·Filed 1996·Granted Feb 8, 2000·33 cites·51 claims
- 1270US7049175B2Method of packaging RF MEMSUNIV ARKANSAS·Filed 2002·Granted May 23, 2006·12 cites·15 claims
- 1370US6297460B1Multichip module and method of forming sameUNIV ARKANSAS·Filed 1995·Granted Oct 2, 2001·26 cites·12 claims
- 1465US5472370AMethod of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefromUNIV ARKANSAS·Filed 1994·Granted Dec 5, 1995·36 cites·27 claims
- 1564US6800939B2Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systemsTRUSTEES FOR THE UNIVERSITY OF·Filed 2002·Granted Oct 5, 2004·15 cites·20 claims
- 1662US6806568B2Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methodsUNIV ARKANSAS·Filed 2001·Granted Oct 19, 2004·10 cites·17 claims
- 1757US5000532AOptical fiber switchAT & T BELL LAB·Filed 1989·Granted Mar 19, 1991·18 cites·1 claims
- 1855US4896937AOptical fiber switchAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Jan 30, 1990·17 cites·17 claims
- 1954US7005722B2RC terminator and production method thereforUNIV ARKANSAS·Filed 2001·Granted Feb 28, 2006·8 cites·20 claims
- 2053US8207021B2Low noise high thermal conductivity mixed signal packageKLING DENNIS R·Filed 2011·Granted Jun 26, 2012·1 cites·20 claims
- 2148US2006211177A1Structure and process for packaging RF MEMS and other devicesUNIV ARKANSAS·Filed 2006·Application pending·0 cites
- 2244US8067833B2Low noise high thermal conductivity mixed signal packageKLING DENNIS R·Filed 2009·Granted Nov 29, 2011·0 cites·27 claims
- 2341US2004016094A1Method of forming capacitor with extremely wide band low impedanceUNIV ARKANSAS·Filed 2003·Application pending·0 cites
- 2440US2001047588A1Electronic interconnection medium having offset electrical mesh planeUNIV ARKANSAS·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →