Inventor · disambiguated record
Karthik Thimmavajjula Narasimha
Also filed as: NARASIMHA KARTHIK THIMMAVAJJULA
8 granted patents·1 pending application·12 citations·filing 2016–2023
81Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC9
Top patents by PatentIndex Score
9 records- 0194US11728168B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·2 cites·18 claims
- 0292US10418243B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2016·Granted Sep 17, 2019·6 cites·20 claims
- 0388US11031262B2Loadlock integrated bevel etcher systemAPPLIED MATERIALS INC·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0483US12211694B2Ultra-high modulus and etch selectivity boron-carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 0574US10636684B2Loadlock integrated bevel etcher systemAPPLIED MATERIALS INC·Filed 2019·Granted Apr 28, 2020·1 cites·20 claims
- 0669US10403515B2Loadlock integrated bevel etcher systemAPPLIED MATERIALS INC·Filed 2016·Granted Sep 3, 2019·1 cites·13 claims
- 0764US10971364B2Ultra-high modulus and etch selectivity boron carbon hardmask filmsAPPLIED MATERIALS INC·Filed 2018·Granted Apr 6, 2021·0 cites·15 claims
- 0849US10599043B2Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware componentsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 24, 2020·0 cites·20 claims
- 0937US2017162417A1Method and apparatus for clamping and declamping substrates using electrostatic chucksAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →