Inventor · disambiguated record
Vincent Dicaprio
Also filed as: DICAPRIO VINCENT · DICAPRIO VINCENT D
51 granted patents·4 pending applications·3,579 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
55 records- 0199US6577013B1Chip size semiconductor packages with stacked diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·559 cites·28 claims
- 0298US10886232B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·16 cites·19 claims
- 0398US6624005B1Semiconductor memory cards and method of making sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 23, 2003·304 cites·3 claims
- 0498US6531784B1Semiconductor package with spacer stripsAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·299 cites·37 claims
- 0598US6395578B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·346 cites·35 claims
- 0698US6340846B1Making semiconductor packages with stacked dies and reinforced wire bondsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 22, 2002·269 cites·21 claims
- 0797US6683377B1Multi-stacked memory packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 27, 2004·214 cites·19 claims
- 0897US6472758B1Semiconductor package including stacked semiconductor dies and bond wiresAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·193 cites·27 claims
- 0996US11264331B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·10 cites·19 claims
- 1096US6798049B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 28, 2004·125 cites·30 claims
- 1196US6762078B2Semiconductor package having semiconductor chip within central aperture of substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·141 cites·15 claims
- 1296US6650019B2Method of making a semiconductor package including stacked semiconductor diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 18, 2003·123 cites·27 claims
- 1395US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 1495US6406934B1Wafer level production of chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·104 cites·20 claims
- 1593US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 1693US7211900B2Thin semiconductor package including stacked diesAMKOR TECHNOLOGY INC·Filed 2005·Granted May 1, 2007·26 cites·20 claims
- 1793US6515356B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·79 cites·12 claims
- 1893US6414396B1Package for stacked integrated circuitsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 2, 2002·85 cites·23 claims
- 1992US7126218B1Embedded heat spreader ball grid arrayAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 24, 2006·108 cites·48 claims
- 2091US6452278B1Low profile package for plural semiconductor diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 17, 2002·102 cites·21 claims
- 2190US6462274B1Chip-scale semiconductor package of the fan-out type and method of manufacturing such packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Oct 8, 2002·127 cites·43 claims
- 2289US6982488B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 3, 2006·45 cites·20 claims
- 2389US6501184B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 31, 2002·58 cites·22 claims
- 2485US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 2585US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 2685US7061120B2Stackable semiconductor package having semiconductor chip within central through hole of substrateAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·33 cites·7 claims
- 2783US11887934B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 2882US6717248B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·27 cites·38 claims
- 2978US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 3077US6589801B1Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniquesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 8, 2003·55 cites·37 claims
- 3176US11521935B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 3275US12476120B2Modular mainframe layout for supporting multiple semiconductor process modules or chambersAPPLIED MATERIALS INC·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 3375US6830955B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·20 cites·12 claims
- 3474US11476202B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 3574US11398433B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·0 cites·19 claims
- 3673US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 3773US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 3873US11264333B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 3971US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 4071US6656765B1Fabricating very thin chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 2, 2003·29 cites·18 claims
- 4170US12444707B2Method for collective dishing of singulated diesAPPLIED MATERIALS INC·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 4270US7190071B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·9 claims
- 4366US6512288B1Circuit board semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·16 cites·18 claims
- 4465US11935771B2Modular mainframe layout for supporting multiple semiconductor process modules or chambersAPPLIED MATERIALS INC·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 4564US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 4664US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4763US6489667B1Semiconductor device and method of manufacturing such deviceAMKOR TECHNOLOGY INC·Filed 1999·Granted Dec 3, 2002·30 cites·18 claims
- 4851US2024021571A1Hybrid bonding of semiconductor structures to advanced substrate panelsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4945US11935770B2Modular mainframe layout for supporting multiple semiconductor process modules or chambersAPPLIED MATERIALS INC·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 5044US11342256B2Method of fine redistribution interconnect formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·18 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →