Inventor · disambiguated record
Mark Harrison
Also filed as: HARRISON MARK · HARRISON MARK JAMES
10 granted patents·2 pending applications·8 citations·filing 2010–2022
81Inventor score
Top patents by PatentIndex Score
12 records- 0176US8487440B2Backside processing of semiconductor devicesHARRISON MARK·Filed 2010·Granted Jul 16, 2013·4 cites·49 claims
- 0271US10115688B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·2 cites·18 claims
- 0371US9553016B2Contacts for semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 24, 2017·2 cites·24 claims
- 0459US12300654B2Semiconductor device with metal silicide layerINFINEON TECHNOLOGIES AG·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 0554US10573611B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 0652US11393736B2Method of manufacturing a semiconductor device having an integrated pn diode temperature sensorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Jul 19, 2022·0 cites·17 claims
- 0752US9824972B2Contacts for semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 21, 2017·0 cites·21 claims
- 0852US8866299B2Backside processing of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 21, 2014·0 cites·20 claims
- 0951US11501979B1Semiconductor device and method of producing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 1046US2019172770A1Semiconductor Device with Integrated pn Diode Temperature SensorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Application pending·0 cites
- 1144US9006899B2Layer stackINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 14, 2015·0 cites·7 claims
- 1242US2015228607A1Layer stacks and integrated circuit arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →