Inventor · disambiguated record
Robin Koshy
Also filed as: KOSHY ROBIN A · KOSHY ROBIN ABRAHAM · KOSHY Robin
5 granted patents·15 pending applications·7 citations·filing 2008–2022
67Inventor score
Top patents by PatentIndex Score
20 records- 0177US8900665B2Method of forming hardmask layer with alternating nanolayersKOSHY ROBIN ABRAHAM·Filed 2012·Granted Dec 2, 2014·7 cites·13 claims
- 0262US12249490B2Single crystal metal oxide plasma chamber componentLAM RES CORP·Filed 2020·Granted Mar 11, 2025·0 cites·11 claims
- 0360US2021343510A1Quartz component with protective coatingLAM RES CORP·Filed 2021·Application pending·0 cites
- 0455US2023331633A1Spark plasma sintered component for plasma processing chamberLAM RES CORP·Filed 2021·Application pending·0 cites
- 0554US11087961B2Quartz component with protective coatingLAM RES CORP·Filed 2018·Granted Aug 10, 2021·0 cites·31 claims
- 0654US2009074522A1Reduced-friction coatingsUNIV NORTHWESTERN·Filed 2008·Application pending·0 cites
- 0752US2023088848A1Yttrium aluminum coating for plasma processing chamber componentsLAM RES CORP·Filed 2021·Application pending·0 cites
- 0852US2025246413A1Coated part for plasma processing chamberLAM RES CORP·Filed 2022·Application pending·0 cites
- 0949US2023215703A1Sealing surfaces of components used in plasma etching tools using atomic layer depositionLAM RES CORP·Filed 2021·Application pending·0 cites
- 1049US2023020387A1Low temperature sintered coatings for plasma chambersLAM RES CORP·Filed 2020·Application pending·0 cites
- 1149US2024212991A1Yttrium aluminum perovskite (yap) based coatings for semiconductor processing chamber componentsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1249US2023295798A1Metal oxide with low temperature fluorinationLAM RES CORP·Filed 2021·Application pending·0 cites
- 1347US9947558B2Method for conditioning silicon partLAM RES CORP·Filed 2016·Granted Apr 17, 2018·0 cites·13 claims
- 1445US9028918B2Forming a hardmask capping layerKOSHY ROBIN ABRAHAM·Filed 2012·Granted May 12, 2015·0 cites·5 claims
- 1545US2022186354A1Surface coating treatmentLAM RES CORP·Filed 2020·Application pending·0 cites
- 1644US2023317424A1Erosion resistant plasma processing chamber componentsLAM RES CORP·Filed 2021·Application pending·0 cites
- 1743US2022246404A1Sealant coating for plasma processing chamber componentsLAM RES CORP·Filed 2020·Application pending·0 cites
- 1841US2022093370A1Textured silicon semiconductor processing chamber componentsLAM RES CORP·Filed 2020·Application pending·0 cites
- 1939US2015200093A1Hardmask capping layerGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 2032US2014110857A1Reduction chemistry for etchingKOSHY ROBIN ABRAHAM·Filed 2012·Application pending·0 cites
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